Adhesion of Resist Micropatterns during Drying after Water Rinse Export

@article{citeulike:1616675, abstract = {The variation of residual strain in photoresist thin films can be detected by a strain gauge with high sensitivity. The adhesion of resist micropattern during drying after water rinse is studied in terms of the residual strain variation. The residual strain of a resist film varies markedly as water is evaporated from the resist surface. In order to improve the resist adhesion, it is important to decrease the residual strain during the drying process.}, author = {Kawai, A.}, citeulike-article-id = {1616675}, citeulike-linkout-0 = {http://adsabs.harvard.edu/cgi-bin/nph-bib_query?bibcode=1995JaJAP..34L1093K}, journal = {Japanese Journal of Applied Physics}, keywords = {adhesion, collapse, drying, fabrication, lithography, pattern, photolithography, photoresist, resist, rinse, water}, month = {August}, pages = {L1093--L1094}, posted-at = {2007-09-03 21:14:01}, priority = {2}, title = {Adhesion of Resist Micropatterns during Drying after Water Rinse}, url = {http://adsabs.harvard.edu/cgi-bin/nph-bib_query?bibcode=1995JaJAP..34L1093K}, volume = {34}, year = {1995} }

TY - JOUR ID - citeulike:1616675 L3 - citeulike-article-id:1616675 N2 - The variation of residual strain in photoresist thin films can be detected by a strain gauge with high sensitivity. The adhesion of resist micropattern during drying after water rinse is studied in terms of the residual strain variation. The residual strain of a resist film varies markedly as water is evaporated from the resist surface. In order to improve the resist adhesion, it is important to decrease the residual strain during the drying process. JF - Japanese Journal of Applied Physics EP - L1094 TI - Adhesion of Resist Micropatterns during Drying after Water Rinse VL - 34 SP - L1093 KW - adhesion KW - collapse KW - drying KW - fabrication KW - lithography KW - pattern KW - photolithography KW - photoresist KW - resist KW - rinse KW - water AU - Kawai, A PY - 1995/August// UR - http://adsabs.harvard.edu/cgi-bin/nph-bib_query?bibcode=1995JaJAP..34L1093K ER -