Sat, 26 Jul 2008 06:06:53 BST CiteULike: dcastro's capacitor http://www.citeulike.org/user/dcastro/tag/capacitor CiteULike.org en-gb Copyright © 2004-2008 citeulike.org http://www.citeulike.org/user/dcastro/article/2836660 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 22, No. 10. (1974), pp. 857-864.</i><br /><br />A simple method is described to calculate the capacitances of rectangular and circular microstrip disk capacitors. From the edge capacitances of the capacitors the influence of the fringing field on the resonance frequencies of microstrip disk resonators is calculated. A theory to compute the resonance frequencies of microstrip resonators with high accuracy is presented. The resonance frequencies are calculated from a resonator model employing an effective width and length or radius, respectively, filled with a medium of a "dynamic dielectric constant." Theoretical and experimental results are compared and found to be in agreement within 1 percent. Rectangular and Circular Microstrip Disk Capacitors and Resonators I Wolff N Knoppik Microwave Theory and Techniques, IEEE Transactions on, Vol. 22, No. 10. (1974), pp. 857-864. 2008-05-27T07:08:23-00:00 1974 Microwave Theory and Techniques, IEEE Transactions on 22 10 857 864 capacitor microstrip http://www.citeulike.org/user/dcastro/article/2808883 <i>URSI (2005)</i> WBIDC: Nuevo condensador interdigital de banda ancha Francisco Pablo Roth Enrique Segura Carlos Peñalosa URSI (2005) 2008-05-18T11:59:41-00:00 2005 URSI capacitor crlh wideband http://www.citeulike.org/user/dcastro/article/2678815 <i>Microwave and Wireless Components Letters, IEEE, Vol. 18, No. 1. (2008), pp. 16-18.</i><br /><br />In this letter, we explore a general-purpose microstrip coupling model for computer aided design of new bandpass filters. The J-inverter topology of the model facilitates the study of coupling behaviours of different microstrip structures leading to a quick comparison of their coupling strengths. Based on such comparison, microstrip filters with interdigital capacitors and etched slots yielding relatively higher coupling coefficients are designed, fabricated and tested. The filters exhibit relatively wider bandwidths which are easily adjustable by way of changing the geometrical parameters of interdigital capacitors and slots. Adjustable Bandwidth Filter Design Based on Interdigital Capacitors Li Zhu V Devabhaktuni Chunyan Wang Ming Yu doi:10.1109/LMWC.2007.911975 Microwave and Wireless Components Letters, IEEE, Vol. 18, No. 1. (2008), pp. 16-18. 2008-04-16T19:38:04-00:00 2008 Microwave and Wireless Components Letters, IEEE 18 1 16 18 capacitor filter interdigital http://www.citeulike.org/user/dcastro/article/2678814 <i>Electron Devices, IEEE Transactions on, Vol. 38, No. 11. (1991), pp. 2575-2577.</i><br /><br />A computer-aided-design-compatible model is described for an interdigital structure in microstrip configuration. The interdigital structure is modeled by using the admittance matrix of the coupled microstrip lines and modified to include the discontinuities and the distributed elements. The model takes into account all the distributed effects of the structure and models them as circuit elements. The equivalent circuit elements of the interdigital structure are computed in closed-form expressions. The results are compared with other models and also with the experimental results. Even though the model does not consider the phase shift along the terminal strip, it is shown to be valid well into the gigahertz range Modeling and design of interdigital structure RT Kollipara AS Mohammed TK Plant VK Tripathi doi:10.1109/16.97430 Electron Devices, IEEE Transactions on, Vol. 38, No. 11. (1991), pp. 2575-2577. 2008-04-16T19:37:43-00:00 1991 Electron Devices, IEEE Transactions on 38 11 2575 2577 capacitor interdigital http://www.citeulike.org/user/dcastro/article/2648154 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 38, No. 12. (1990), pp. 1808-1815.</i><br /><br />Equivalent capacitances of coplanar waveguide discontinuities on multilayered substrates are calculated using a three-dimensional finite-different method. The application of the method is demonstrated for open ends and gaps in microstrip and coplanar waveguides, as well as for more complicated structures such as interdigitated capacitors. The main advantage of the method is its flexibility in treating multilayered substrates and different conductor configurations. It can therefore be applied to more complicated structures such as interdigitated capacitors, air bridges, and waveguide transitions. The effect of conductor metallization thickness and shielding walls is also taken into account. Good agreement between the calculated data and measurements up to 25 GHz in the case of coplanar structures indicates the validity of the static analysis even for high frequencies Equivalent capacitances of coplanar waveguide discontinuities and interdigitated capacitors using a three-dimensional finite difference method M Naghed I Wolff doi:10.1109/22.64560 Microwave Theory and Techniques, IEEE Transactions on, Vol. 38, No. 12. (1990), pp. 1808-1815. 2008-04-10T06:44:30-00:00 1990 Microwave Theory and Techniques, IEEE Transactions on 38 12 1808 1815 capacitor coplanar interdigital http://www.citeulike.org/user/dcastro/article/2640648 <i>Electrical Performance of Electronic Packaging, 1998. IEEE 7th topical Meeting on (1998), pp. 209-212.</i><br /><br />Power and ground decoupling is typically accomplished using a hierarchy of discrete capacitors in the power distribution network. As operating frequencies increase, the use of decoupling capacitors integrated in the substrate becomes more pressing. We present a partial element equivalent circuit (PEEC) based modeling approach especially suited for such integrated capacitors, together with TDR and high-frequency S-parameter measurement, and model validation via use of specially fabricated test structures Power decoupling with integral capacitors and area array connections E Diaz-Alvarez JP Krusius F Kroeger doi:10.1109/EPEP.1998.733981 Electrical Performance of Electronic Packaging, 1998. IEEE 7th topical Meeting on (1998), pp. 209-212. 2008-04-08T06:59:17-00:00 1998 Electrical Performance of Electronic Packaging, 1998. IEEE 7th topical Meeting on 209 212 capacitor integrated tesis http://www.citeulike.org/user/dcastro/article/2640602 <i>Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on], Vol. 23, No. 4. (2000), pp. 611-619.</i><br /><br />Power and ground decoupling is typically accomplished using a hierarchy of discrete capacitors spread throughout the power distribution network. Many of the limitations of discrete decoupling capacitors can be overcome with integrated capacitors. A modeling approach for integrated capacitors based on the partial-element-equivalent-circuit (PEEC) formulation is presented. This approach has been applied to 3M C-ply, a flexible planar integrated capacitor technology that can be laminated into multilayer substrates, such as printed wiring boards. The decoupling capability of 3M C-Ply technology for chip power distribution has been compared with conventional surface-mount technology (SMT) Modeling and simulation of integrated capacitors for high frequency chip power decoupling E Diaz-Alvarez JP Krusius F Kroeger doi:10.1109/6144.888843 Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on], Vol. 23, No. 4. (2000), pp. 611-619. 2008-04-08T06:46:46-00:00 2000 Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on] 23 4 611 619 capacitor integrated microstrip model planar tesis http://www.citeulike.org/user/dcastro/article/2060699 <i>ASIC, 2001. Proceedings. 4th International Conference on (2001), pp. 800-805.</i><br /><br />The recent aggressive downsizing of CMOS devices makes it potential to implement RF front-end in the CMOS process, but RF circuits have some special demands which the standard digital CMOS process does not consider: low noise, high linearity, high quality passive components. These demands present the main barriers to implement the RF front-end in CMOS process and need special efforts to get good performance. This paper discusses some relevant issues to the implementations of RF front-end in CMOS process Challenges in RF analog integrated circuits Shi Bingxue ASIC, 2001. Proceedings. 4th International Conference on (2001), pp. 800-805. 2007-12-05T12:10:34-00:00 2001 ASIC, 2001. Proceedings. 4th International Conference on 800 805 capacitor circuits component inductor http://www.citeulike.org/user/dcastro/article/2060687 <i>VLSI Circuits Digest of Technical Papers, 2002. Symposium on (2002), pp. 22-25.</i><br /><br />A new metal-metal capacitor with a small parasitic inductance, named a bending-comb capacitor (BCC), is proposed based on a standard digital CMOS technology. The BCC is applicable to high frequency circuits due to its high self-resonance frequency. An analytical evaluation of the capacitance from the geometry size is also presented. The self-resonance frequency of the BCC of 0.85 pF with the size of 10 /spl mu/m /spl times/ 100 /spl mu/m is estimated as 374 GHz with a 0.13-/spl mu/m Cu-wiring CMOS process. This frequency is about six times higher than that estimated by the conventional comb capacitor. Bending-comb capacitor with a small parasitic inductance A Imamura M Fujishima K Hoh VLSI Circuits Digest of Technical Papers, 2002. Symposium on (2002), pp. 22-25. 2007-12-05T12:06:13-00:00 2002 VLSI Circuits Digest of Technical Papers, 2002. Symposium on 22 25 capacitor http://www.citeulike.org/user/dcastro/article/2060685 <i>Solid-State Circuits, IEEE Journal of, Vol. 37, No. 3. (2002), pp. 384-393.</i><br /><br />Theoretical limits for the capacitance density of integrated capacitors with combined lateral and vertical field components are derived. These limits are used to investigate the efficiency of various capacitive structures such as lateral flux and quasifractal capacitors. This study leads to two new capacitor structures with high lateral-field efficiencies. These new capacitors demonstrate larger capacities, superior matching properties, tighter tolerances, and higher self-resonance frequencies than the standard horizontal parallel plate and previously reported lateral-field capacitors, while maintaining comparable quality factors. These superior qualities are verified by simulation and experimental results Capacity limits and matching properties of integrated capacitors R Aparicio A Hajimiri Solid-State Circuits, IEEE Journal of, Vol. 37, No. 3. (2002), pp. 384-393. 2007-12-05T12:05:36-00:00 2002 Solid-State Circuits, IEEE Journal of 37 3 384 393 capacitor http://www.citeulike.org/user/dcastro/article/2060669 <i>Microelectronics, 2003. ICM 2003. Proceedings of the 15th International Conference on (2003), pp. 287-290.</i><br /><br />This paper investigates the usage of the family of space filling curves in capacitor design. Some of the known family members are studied regarding their applications as area efficient capacitor elements. One of the main advantages of these structures is that they divide the space into two continuous electrodes. This makes extra connecting vias and metal layers unnecessary, and enables implementation on a single metal layer. The capacitance of the suggested structures are obtained and compared with some of the reference structures such as the interdigitated and woven capacitors. Investigation of space filling capacitors T Moselhy H Ghali HF Ragaie H Haddara Microelectronics, 2003. ICM 2003. Proceedings of the 15th International Conference on (2003), pp. 287-290. 2007-12-05T11:56:53-00:00 2003 Microelectronics, 2003. ICM 2003. Proceedings of the 15th International Conference on 287 290 capacitor fractal http://www.citeulike.org/user/dcastro/article/2060666 <i>Solid-State Circuits, IEEE Journal of, Vol. 33, No. 12. (1998), pp. 2035-2041.</i><br /><br />A linear capacitor structure using fractal geometries is described. This capacitor exploits both lateral and vertical electric fields to increase the capacitance per unit area. Compared to standard parallel-plate capacitors, the parasitic bottom-plate capacitance is reduced. Unlike conventional metal-to-metal capacitors, the capacitance density increases with technology scaling. A classic fractal structure is implemented with 0.6-μm metal spacing, and a factor of 2.3 increase in the capacitance per unit area is observed. It is shown that capacitance boost factors in excess of ten may be possible as technology continues to scale. A computer-aided-design tool to automatically generate and analyze custom fractal layouts has been developed Fractal capacitors H Samavati A Hajimiri AR Shahani GN Nasserbakht TH Lee Solid-State Circuits, IEEE Journal of, Vol. 33, No. 12. (1998), pp. 2035-2041. 2007-12-05T11:56:24-00:00 1998 Solid-State Circuits, IEEE Journal of 33 12 2035 2041 capacitor fractal http://www.citeulike.org/user/dcastro/article/2060611 <i>(1998)</i><br /><br />A linear capacitor structure using fractal geometries is described. This capacitor exploits both lateral and vertical electric fields to increase the capacitance per unit area. Compared to standard parallel-plate capacitors, the parasitic bottomplate capacitance is reduced. Unlike conventional metal-to-metal capacitors, the capacitance density increases with technology scaling. A classic fractal structure is implemented with 0.6-m metal spacing, and a factor of 2.3 increase in the capacitance... Fractal Capacitors H Samavati A Hajimiri A Shahani G Nasserbakht T Lee (1998) 2007-12-05T11:31:07-00:00 1998 capacitor fractal http://www.citeulike.org/user/dcastro/article/1992111 <i>Microwave Symposium Digest, 1998 IEEE MTT-S International, Vol. 3 (1998), pp. 1755-1758 vol.3.</i><br /><br />A general-purpose CAD-oriented circuit model is presented for accurately modeling interdigital capacitor (IDC) in optimized design of low-loss IDC-related microstrip circuits. This equivalent model is formulated as an admittance-based π-network through the use of a so-called “Short-Open Calibration (SOC)” technique for extracting precisely circuit parameters from a fullwave method of moments (MoM). A J-inverter based topology is further developed for explicit characterization of IDC-related coupling characteristics that accounts for frequency dispersion and fringing effect. Extracted model parameters are given for two types of IDC structure and the model accuracy is well validated by our experiments for an IDC-related quasi-lumped bandpass filter A general-purpose circuit model of interdigital capacitor for accurate design of low-loss microstrip circuit Lei Zhu Ke Wu doi:10.1109/MWSYM.1998.700809 Microwave Symposium Digest, 1998 IEEE MTT-S International, Vol. 3 (1998), pp. 1755-1758 vol.3. 2007-11-27T10:24:18-00:00 1998 Microwave Symposium Digest, 1998 IEEE MTT-S International 3 1755 1758 vol.3 capacitor circuit interdigital microstrip model http://www.citeulike.org/user/dcastro/article/1992100 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 50, No. 10. (2002), pp. 2412-2413.</i> Corrections to "accurate circuit model of interdigital capacitor and its application to design of new quasi-lumped miniaturized filters with suppression of harmonic resonance" Lei Zhu Ke Wu doi:10.1109/TMTT.2002.803452 Microwave Theory and Techniques, IEEE Transactions on, Vol. 50, No. 10. (2002), pp. 2412-2413. 2007-11-27T10:23:01-00:00 2002 Microwave Theory and Techniques, IEEE Transactions on 50 10 2412 2413 capacitor circuits filter interdigital lumped model http://www.citeulike.org/user/dcastro/article/1992095 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 36, No. 2. (1988), pp. 294-304.</i><br /><br />Lumped elements are considered as very attractive structures for the realisation of MMICs with respect to considerable size-reduction. Improved models for integrable lumped-element straight-line, single-loop, and spiral inductors, as well as for interdigitated and MIM capacitors, have been derived using numerical solutions of the inductance integral, basic microstrip theory, and network analysis. The broad experimental verification shows good agreement between models and experiments, with deviations of 5-10% up to 18 GHz. Besides the practical values and frequency range, losses of the lumped elements are presented CAD models of lumped elements on GaAs up to 18 GHz E Pettenpaul H Kapusta A Weisgerber H Mampe J Luginsland I Wolff Microwave Theory and Techniques, IEEE Transactions on, Vol. 36, No. 2. (1988), pp. 294-304. 2007-11-27T10:22:35-00:00 1988 Microwave Theory and Techniques, IEEE Transactions on 36 2 294 304 cad capacitor inductor lumped http://www.citeulike.org/user/dcastro/article/1992079 <i>Electronics Letters, Vol. 40, No. 7. (2004), pp. 433-434.</i><br /><br />A novel defected ground structure (DGS) microstrip resonator is proposed. The proposed DGS resonator has the resonant and anti-resonant characteristic that is very similar to those of a surface acoustic wave resonator or a film bulk acoustic resonator (FBAR). To confirm the validity of the proposed resonator, bandpass filters were designed and implemented using series and parallel resonators. DGS resonator with interdigital capacitor and application to bandpass filter design JS Park JS Yun CS Park Electronics Letters, Vol. 40, No. 7. (2004), pp. 433-434. 2007-11-27T10:19:53-00:00 2004 Electronics Letters 40 7 433 434 bandpass capacitor filter interdigital http://www.citeulike.org/user/dcastro/article/1988303 <i>Microwave Symposium Digest, G-MTT International, Vol. 70, No. 1. (1970), pp. 7-13.</i><br /><br />An analysis of the frequency response of interdigital capacitors is given along with an equation for their design. The capacitor Q is given in terms of its geometry which consists of a planar interdigital conductor deposited on the surface of a substrate. Capacitance values ranging from 0.1 to 10 pF at L band with measured Q's in excess of 400 are realizable. Interdigital Capacitors for Use in Lumped-Element Microwave Integrated Circuits GD Alley Microwave Symposium Digest, G-MTT International, Vol. 70, No. 1. (1970), pp. 7-13. 2007-11-26T20:29:15-00:00 1970 Microwave Symposium Digest, G-MTT International 70 1 7 13 capacitor interdigital lumped http://www.citeulike.org/user/dcastro/article/1988289 <i>Microwave and Wireless Components Letters, IEEE, Vol. 15, No. 10. (2005), pp. 700-702.</i><br /><br />Interdigital capacitors (IDCs) are convenient capacitance devices in microstrip circuits, even if only low capacitance values can be achieved. Nevertheless, undesired resonances degrade their performance when frequency increases. Short circuits across the end of alternate fingers of the IDC improve its high frequency response by eliminating that drawback. Simulated and measured results are presented. Wire bonded interdigital capacitor FP Casares-Miranda P Otero E Marquez-Segura C Camacho-Penalosa Microwave and Wireless Components Letters, IEEE, Vol. 15, No. 10. (2005), pp. 700-702. 2007-11-26T20:27:05-00:00 2005 Microwave and Wireless Components Letters, IEEE 15 10 700 702 capacitor interdigital http://www.citeulike.org/user/dcastro/article/1988226 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 44, No. 6. (1996), pp. 896-904.</i><br /><br />Conformal mapping-based models are given for interdigital capacitors on substrates with a thin superstrate and/or covering dielectric film. The models are useful for a wide range of dielectric constants and layer thicknesses. Capacitors with finger numbers n&ges;2 are discussed. The finger widths and spacing between them may be different. The results are compared with the available data and some examples are given to demonstrate the potential of the models CAD models for multilayered substrate interdigital capacitors SS Gevorgian T Martinsson PLJ Linner EL Kollberg Microwave Theory and Techniques, IEEE Transactions on, Vol. 44, No. 6. (1996), pp. 896-904. 2007-11-26T20:11:54-00:00 1996 Microwave Theory and Techniques, IEEE Transactions on 44 6 896 904 capacitor interdigital http://www.citeulike.org/user/dcastro/article/1988199 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 48, No. 3. (2000), pp. 347-356.</i><br /><br />A general-purpose circuit model of a microstrip interdigital capacitor (IDC) is presented in this paper for use in the design of new quasi-lumped miniaturized filters. This computer-aided-design-oriented model is developed as a versatile admittance π-network with the short-open calibration technique that we have recently proposed for accurate parameter extraction of a circuit from its physical layout. This technique is self-contained in our method of moments, which accounts for frequency dispersion and fringing effects. A J-inverter topology is further conceived to explicitly formulate the coupling behavior of three types of IDC's. This model provides a unique way for the IDC-related circuit synthesis and optimization based on the accurate equivalent-circuit network extracted from the field theory algorithm. It is validated theoretically and experimentally through an example of a line resonator connected with two IDC's. The proposed scheme is used in the design and optimization of new low-loss miniaturized quasilumped integrated circuits, namely, two types of three-pole direct-coupled bandpass filters. Our measured and predicted results show interesting features of the proposed filter structure such as size reduction and suppression of harmonic resonance if the line resonator is attached by series-connected equivalent inductance Accurate circuit model of interdigital capacitor and its application to design of new quasi-lumped miniaturized filters with suppression of harmonic resonance Lei Zhu Ke Wu doi:10.1109/22.826833 Microwave Theory and Techniques, IEEE Transactions on, Vol. 48, No. 3. (2000), pp. 347-356. 2007-11-26T20:06:00-00:00 2000 Microwave Theory and Techniques, IEEE Transactions on 48 3 347 356 capacitor filter interdigital lumped http://www.citeulike.org/user/dcastro/article/1988196 <i>International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, Vol. 15, No. 2. (2002), pp. 169-179.</i><br /><br />This paper presents the application of an iterative method for fast computation of microstrip interdigital capacitor (IDC) and a quasi-lumped miniaturized filter. The use of a 2D-FFT algorithm allows simplifications in the calculation process leading to accurate results obtained 20 times faster than in the conventional method cases. Copyright © 2002 John Wiley & Sons, Ltd. Analysis of interdigital capacitor and quasi-lumped miniaturized filters using iterative method A Gharsallah A Gharbi L Desclos H Baudrand doi:10.1002/jnm.448 International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, Vol. 15, No. 2. (2002), pp. 169-179. 2007-11-26T20:05:31-00:00 2002 International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 15 2 169 179 capacitor filter interdigital http://www.citeulike.org/user/dcastro/article/1988192 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 18, No. 12. (1970), pp. 1028-1033.</i><br /><br />An analysis of the frequency response of interdigital capacitors, which leads to an optimal design, is given along with an expression for their static gap capacitance. The capacitor Q is given in terms of its geometry which consists of a planar interdigital thin-filrn conductor deposited on the surface of a relatively high dielectric constant substrate. Capacitance values ranging from 0.1 to 10 pF at L band with measured Q's in excess of 400 are realizable using 2-mil line and space widths on a 99.5-percent alumina substrate with a dielectric constant of 10.3. Experimental results obtained with a lumped-constant nine-section S-band Chebyscheff low-pass filter realized using spiral inductors and optimal designed interdigital capacitors are shown to be in excellent agreement with theory. The filter had less than 0.8-dB insertion loss and greater than 25dB return loss in the passband. The filter occupies an area 6.50 by 200 roils on a 24-mil-thick substrate. Interdigital Capacitors and Their Application to Lumped-Element Microwave Integrated Circuits GD Alley Microwave Theory and Techniques, IEEE Transactions on, Vol. 18, No. 12. (1970), pp. 1028-1033. 2007-11-26T20:04:40-00:00 1970 Microwave Theory and Techniques, IEEE Transactions on 18 12 1028 1033 capacitor interdigital http://www.citeulike.org/user/dcastro/article/1915048 <i>Microwave Symposium Digest, 2003 IEEE MTT-S International, Vol. 3 (2003), pp. 1889-1892 vol.3.</i><br /><br />Novel resonators composed of double-spiral inductors and interdigital capacitors are developed, which not only are compact in size but also have no harmonics up to three times of the fundamental frequency. The center frequency is insensitive to the thickness of the substrate. A miniature seven-pole narrow-band HTS bandpass microstrip filter has been designed, fabricated and tested for an astronomy observation application, which requires a center frequency at 610 MHz and 0.82% fractional bandwidth. The computed and measured results are found in excellent agreement. Superconducting microstrip filters using compact resonators with double-spiral inductors and interdigital capacitors Jiafeng Zhou MJ Lancaster F Huang Microwave Symposium Digest, 2003 IEEE MTT-S International, Vol. 3 (2003), pp. 1889-1892 vol.3. 2007-11-14T17:46:09-00:00 2003 Microwave Symposium Digest, 2003 IEEE MTT-S International 3 1889 1892 vol.3 capacitor filters inductor interdigital microstrip http://www.citeulike.org/user/dcastro/article/1880288 <i>Microwave and Wireless Components Letters, IEEE, Vol. 16, No. 11. (2006), pp. 624-626.</i><br /><br />An enhanced composite right/left-handed (CRLH) transmission line (TL) is presented in this letter. This TL, designed in microstrip technology, is implemented by means of a new improved interdigital capacitor (IDC), the so-called wire bonded IDC (WBIDC). The use of the WBIDC broadens the frequency band where the CRLH TL can be considered as a TL. A conventional 70-Omega CRLH TL (using IDCs) has been compared, by full-wave simulation and measurements, with its enhanced counterpart (using WBIDCs). In addition, this enhanced CRLH TL has been used to design a CRLH diplexer which presents several advantages over standard CRLH coupled lines (using IDCs). The diplexer response has been verified by means of a full-wave electromagnetic solver Composite Right/Left-Handed Transmission Line With Wire Bonded Interdigital Capacitor FP Casares-Miranda E Marquez-Segura P Otero C Camacho-Penalosa Microwave and Wireless Components Letters, IEEE, Vol. 16, No. 11. (2006), pp. 624-626. 2007-11-07T18:39:01-00:00 2006 Microwave and Wireless Components Letters, IEEE 16 11 624 626 capacitor crlh interdigital tl http://www.citeulike.org/user/dcastro/article/1880287 <i>Microwave Theory and Techniques, IEEE Transactions on, Vol. 54, No. 2. (2006), pp. 748-754.</i><br /><br />The wire-bonded interdigital capacitor (WBIDC) is an interdigital capacitor with short circuits across the end of alternate fingers that result in an improved frequency response. This paper presents the analytical and circuital models of the WBIDC, which are useful to design and to incorporate into an electromagnetic or circuit analysis computer-aided design program. Design equations of the WBIDC are also presented. The analytical model and design equations have been validated with numerical analysis and experimental work. Analytical model of the wire-bonded interdigital capacitor E Marquez-Segura FP Casares-Miranda P Otero C Camacho-Penalosa JE Page Microwave Theory and Techniques, IEEE Transactions on, Vol. 54, No. 2. (2006), pp. 748-754. 2007-11-07T18:38:40-00:00 2006 Microwave Theory and Techniques, IEEE Transactions on 54 2 748 754 capacitor interdigital