<?xml version="1.0" encoding="UTF-8"?>

<rdf:RDF
   xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#"
   xmlns:rdfs="http://www.w3.org/2000/01/rdf-schema#"
   xmlns="http://purl.org/rss/1.0/"
   xmlns:dc="http://purl.org/dc/elements/1.1/"
   xmlns:prism="http://prismstandard.org/namespaces/1.2/basic/"
   xmlns:dcterms="http://purl.org/dc/terms/"

>
<channel rdf:about="http://www.citeulike.org/about">
<pubDate>Sun, 27 Jul 2008 07:39:46 BST</pubDate>


	<title>CiteULike: dcastro's component</title>
	<description>CiteULike: dcastro's component</description>


	<link>http://www.citeulike.org/user/dcastro/tag/component</link>
	<dc:publisher>CiteULike.org</dc:publisher>
	<dc:language>en-gb</dc:language>
	<dc:rights>Copyright &#169; 2004-2008 citeulike.org</dc:rights>
	<items>
    <rdf:Seq>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/2776124"/>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/2648184"/>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/2648117"/>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/2421332"/>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/2072413"/>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/2060699"/>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/1870048"/>
        <rdf:li rdf:resource="http://www.citeulike.org/user/dcastro/article/1856858"/>

	</rdf:Seq>
	</items>
	</channel>


<item rdf:about="http://www.citeulike.org/user/dcastro/article/2776124">
    <title>Some applications of MATHCAD and MATLAB in microwave component synthesis</title>
    <link>http://www.citeulike.org/user/dcastro/article/2776124</link>
    <description>&lt;i&gt;The Use of Systems Analysis and Modelling Tools: Experiences and Applications (Ref. No. 1998/413), IEE Colloquium on (1998), pp. 6/1-6/6.&lt;/i&gt;&lt;br /&gt;&lt;br /&gt;This paper describes a range of different applications of MATHCAD and MATLAB in microwave component synthesis. The examples are drawn from both research and teaching in microwave engineering</description>
    <dc:title>Some applications of MATHCAD and MATLAB in microwave component synthesis</dc:title>

    <dc:creator>P Gardner</dc:creator>
    <dc:source>The Use of Systems Analysis and Modelling Tools: Experiences and Applications (Ref. No. 1998/413), IEE Colloquium on (1998), pp. 6/1-6/6.</dc:source>
    <dc:date>2008-05-09T15:20:56-00:00</dc:date>
    <prism:publicationYear>1998</prism:publicationYear>
    <prism:publicationName>The Use of Systems Analysis and Modelling Tools: Experiences and Applications (Ref. No. 1998/413), IEE Colloquium on</prism:publicationName>
    <prism:startingPage>6/1</prism:startingPage>
    <prism:endingPage>6/6</prism:endingPage>
    <prism:category>component</prism:category>
    <prism:category>matlab</prism:category>
    <prism:category>microwave</prism:category>
</item>



<item rdf:about="http://www.citeulike.org/user/dcastro/article/2648184">
    <title>Embedded components in printed circuit boards: a processing technology review</title>
    <link>http://www.citeulike.org/user/dcastro/article/2648184</link>
    <description>&lt;i&gt;The International Journal of Advanced Manufacturing Technology, Vol. 25, No. 3. (1 February 2005), pp. 350-360.&lt;/i&gt;&lt;br /&gt;&lt;br /&gt;It is evident that embedded passive components (EPCs) allow packaging substrate miniaturization and have the potential to reduce costs. Moreover, they exhibit superior electrical behaviour with respect to the minimization of parasitic effects. However, as for most emerging technologies, there is no well-established process or method for EPCs that lead to the desired result, but many have been and are still being investigated. This article attempts to review the state of the art of resistor and capacitor EPCs, including an assessment of the pros and cons of the various technologies pursued. In the review, it is found that compared to discrete surface mount devices, EPCs provide (in order of current importance): space reduction of 30% or more, better HF signal integrity and potential cost reduction. Embedded resistors in thin-film technology are, in general, restricted to small resistance values up to a few kΩ. Embedded resistors in ceramic thick-film technology require a high temperature curing process and much care during lamination, but they can be combined with embedded capacitors and exhibit high stability. Whereas embedded resistors in polymer thick-film technology require a low curing temperature and can be combined with capacitors, they exhibit poorer electrical properties and stability. Moreover, tolerances of embedded resistors after manufacturing are exceeded by 15%, independent of the manufacturing technology, which means that laser trimming is required. Embedded capacitors are based mostly on barium-titanite with a dielectric constant of only approximately 20, which limits the capacitance density to a few nF/in 2. Ferroelectric material with a dielectric constant up to 2000 for embedded capacitors has been investigated but not yet established. Besides the traditional screen print technology for the deposition of pastes and inks, the ink-jet technology becomes more promising. Much higher flexibility with respect to material composition, layer thickness and even active components like LEDs have already been produced by ink-jetting.</description>
    <dc:title>Embedded components in printed circuit boards: a processing technology review</dc:title>

    <dc:creator>W Jillek</dc:creator>
    <dc:creator>WKC Yung</dc:creator>
    <dc:identifier>doi:10.1007/s00170-003-1872-y</dc:identifier>
    <dc:source>The International Journal of Advanced Manufacturing Technology, Vol. 25, No. 3. (1 February 2005), pp. 350-360.</dc:source>
    <dc:date>2008-04-10T06:55:04-00:00</dc:date>
    <prism:publicationYear>2005</prism:publicationYear>
    <prism:publicationName>The International Journal of Advanced Manufacturing Technology</prism:publicationName>
    <prism:volume>25</prism:volume>
    <prism:number>3</prism:number>
    <prism:startingPage>350</prism:startingPage>
    <prism:endingPage>360</prism:endingPage>
    <prism:category>circuit</prism:category>
    <prism:category>component</prism:category>
    <prism:category>microwave</prism:category>
    <prism:category>printed</prism:category>
</item>



<item rdf:about="http://www.citeulike.org/user/dcastro/article/2648117">
    <title>Planar microwave and millimeter-wave lumped elements and coupled-line filters using micro-machining techniques</title>
    <link>http://www.citeulike.org/user/dcastro/article/2648117</link>
    <description>&lt;i&gt;Microwave Theory and Techniques, IEEE Transactions on, Vol. 43, No. 4. (1995), pp. 730-738.&lt;/i&gt;&lt;br /&gt;&lt;br /&gt;Planar microwave and millimeter-wave inductors and capacitors have been fabricated on high-resistivity silicon substrates using micro-machining techniques. The inductors and capacitors are suspended on a thin dielectric membrane to reduce the parasitic capacitance to ground. The resonant frequencies of a 1.2 nH and a 1.7-nH inductor have been increased from 22 GHz and 17 GHz to around 70 GHz and 50 GHz, respectively. We also report on the design and measurement of a new class of stripline filters suspended on a thin dielectric membrane. Interdigitated filters with 43% and 5% bandwidth have been fabricated and exhibit a port-to-port 0.7 dB and 2.0 dB loss, respectively, at 14-15 GHz. The micro-machining fabrication technique can be used with silicon and GaAs substrates in microstrip or coplanar-waveguide configurations to result in planar low-loss lumped elements and filters suitable for monolithic integration or surface mount devices up to 100 GHz</description>
    <dc:title>Planar microwave and millimeter-wave lumped elements and coupled-line filters using micro-machining techniques</dc:title>

    <dc:creator>Chen-Yu Chi</dc:creator>
    <dc:creator>GM Rebiez</dc:creator>
    <dc:identifier>doi:10.1109/22.375218</dc:identifier>
    <dc:source>Microwave Theory and Techniques, IEEE Transactions on, Vol. 43, No. 4. (1995), pp. 730-738.</dc:source>
    <dc:date>2008-04-10T06:26:36-00:00</dc:date>
    <prism:publicationYear>1995</prism:publicationYear>
    <prism:publicationName>Microwave Theory and Techniques, IEEE Transactions on</prism:publicationName>
    <prism:volume>43</prism:volume>
    <prism:number>4</prism:number>
    <prism:startingPage>730</prism:startingPage>
    <prism:endingPage>738</prism:endingPage>
    <prism:category>component</prism:category>
    <prism:category>filter</prism:category>
    <prism:category>lumped</prism:category>
    <prism:category>microwave</prism:category>
    <prism:category>planar</prism:category>
    <prism:category>tesis</prism:category>
</item>



<item rdf:about="http://www.citeulike.org/user/dcastro/article/2421332">
    <title>Workshop on transceiver architecture and components for wireless communication system</title>
    <link>http://www.citeulike.org/user/dcastro/article/2421332</link>
    <description>&lt;i&gt;ASIC/SOC Conference, 2002. 15th Annual IEEE International (2002), pp. 479-480.&lt;/i&gt;</description>
    <dc:title>Workshop on transceiver architecture and components for wireless communication system</dc:title>

    <dc:creator>S Martin</dc:creator>
    <dc:creator>Zhengxiang Ma</dc:creator>
    <dc:source>ASIC/SOC Conference, 2002. 15th Annual IEEE International (2002), pp. 479-480.</dc:source>
    <dc:date>2008-02-24T12:53:18-00:00</dc:date>
    <prism:publicationYear>2002</prism:publicationYear>
    <prism:publicationName>ASIC/SOC Conference, 2002. 15th Annual IEEE International</prism:publicationName>
    <prism:startingPage>479</prism:startingPage>
    <prism:endingPage>480</prism:endingPage>
    <prism:category>architecture</prism:category>
    <prism:category>communication</prism:category>
    <prism:category>component</prism:category>
    <prism:category>system</prism:category>
    <prism:category>transceiver</prism:category>
    <prism:category>wireless</prism:category>
    <prism:category>workshop</prism:category>
</item>



<item rdf:about="http://www.citeulike.org/user/dcastro/article/2072413">
    <title>LTCC triplexer for WiMax applications</title>
    <link>http://www.citeulike.org/user/dcastro/article/2072413</link>
    <description>&lt;i&gt;Microwave Conference, 2005 European, Vol. 1 (2005), 4 pp..&lt;/i&gt;&lt;br /&gt;&lt;br /&gt;In the present work, a design procedure for multiplexer development has been described. This procedure allows to reduce development time by using of some local optimizations instead of one global. LTCC (low-temperature co-fired ceramic) triplexer for WiMax (IEEE 802.16e) applications, designed in accordance with described procedure, has been presented. The measured results agree well with the simulation.</description>
    <dc:title>LTCC triplexer for WiMax applications</dc:title>

    <dc:creator>D Orlenko</dc:creator>
    <dc:creator>G Sevskiy</dc:creator>
    <dc:creator>T Kerssenbrock</dc:creator>
    <dc:creator>P Heide</dc:creator>
    <dc:source>Microwave Conference, 2005 European, Vol. 1 (2005), 4 pp..</dc:source>
    <dc:date>2007-12-07T10:18:27-00:00</dc:date>
    <prism:publicationYear>2005</prism:publicationYear>
    <prism:publicationName>Microwave Conference, 2005 European</prism:publicationName>
    <prism:volume>1</prism:volume>
    <prism:startingPage>4 pp.</prism:startingPage>
    <prism:category>component</prism:category>
    <prism:category>rf</prism:category>
    <prism:category>wimax</prism:category>
</item>



<item rdf:about="http://www.citeulike.org/user/dcastro/article/2060699">
    <title>Challenges in RF analog integrated circuits</title>
    <link>http://www.citeulike.org/user/dcastro/article/2060699</link>
    <description>&lt;i&gt;ASIC, 2001. Proceedings. 4th International Conference on (2001), pp. 800-805.&lt;/i&gt;&lt;br /&gt;&lt;br /&gt;The recent aggressive downsizing of CMOS devices makes it potential to implement RF front-end in the CMOS process, but RF circuits have some special demands which the standard digital CMOS process does not consider: low noise, high linearity, high quality passive components. These demands present the main barriers to implement the RF front-end in CMOS process and need special efforts to get good performance. This paper discusses some relevant issues to the implementations of RF front-end in CMOS process</description>
    <dc:title>Challenges in RF analog integrated circuits</dc:title>

    <dc:creator>Shi Bingxue</dc:creator>
    <dc:source>ASIC, 2001. Proceedings. 4th International Conference on (2001), pp. 800-805.</dc:source>
    <dc:date>2007-12-05T12:10:34-00:00</dc:date>
    <prism:publicationYear>2001</prism:publicationYear>
    <prism:publicationName>ASIC, 2001. Proceedings. 4th International Conference on</prism:publicationName>
    <prism:startingPage>800</prism:startingPage>
    <prism:endingPage>805</prism:endingPage>
    <prism:category>capacitor</prism:category>
    <prism:category>circuits</prism:category>
    <prism:category>component</prism:category>
    <prism:category>inductor</prism:category>
</item>



<item rdf:about="http://www.citeulike.org/user/dcastro/article/1870048">
    <title>Arbitrarily dual-band components using simplified structures of conventional CRLH TLs</title>
    <link>http://www.citeulike.org/user/dcastro/article/1870048</link>
    <description>&lt;i&gt;Microwave Theory and Techniques, IEEE Transactions on, Vol. 54, No. 7. (2006), pp. 2902-2909.&lt;/i&gt;&lt;br /&gt;&lt;br /&gt;Microwave components with nonlinear phase responses are developed using a simplified composite right/left-handed (CRLH) transmission-line (TL) structure without the series capacitance or the shunt inductance. Using such a simplified CRLH structure, arbitrarily dual-band microstrip components have been realized in compact sizes such as a quarter-wavelength short-circuited stub and dual- band branch-line couplers. Simulation and measurement results are given to demonstrate the efficiency and good performance of the proposed components. For the quarter- wavelength short-circuited stub based on the simplified CRLH-TL structure without the series capacitance, it has been shown that the insertion loss is less than -0.1dB. For the arbitrarily dual-band branch-line coupler, experiment results exhibit that S/sub 21/ and S/sub 31/ are larger than -3.6dB, the isolations are smaller than -30dB, the return losses are smaller than -20dB, and the phase differences are within 90/spl deg//spl plusmn/1.8/spl deg/.</description>
    <dc:title>Arbitrarily dual-band components using simplified structures of conventional CRLH TLs</dc:title>

    <dc:creator>Xian Lin</dc:creator>
    <dc:creator>Ruo Liu</dc:creator>
    <dc:creator>Xin Yang</dc:creator>
    <dc:creator>Ji Chen</dc:creator>
    <dc:creator>Xiao Yin</dc:creator>
    <dc:creator>Qiang Cheng</dc:creator>
    <dc:creator>Tie Cui</dc:creator>
    <dc:source>Microwave Theory and Techniques, IEEE Transactions on, Vol. 54, No. 7. (2006), pp. 2902-2909.</dc:source>
    <dc:date>2007-11-05T20:33:09-00:00</dc:date>
    <prism:publicationYear>2006</prism:publicationYear>
    <prism:publicationName>Microwave Theory and Techniques, IEEE Transactions on</prism:publicationName>
    <prism:volume>54</prism:volume>
    <prism:number>7</prism:number>
    <prism:startingPage>2902</prism:startingPage>
    <prism:endingPage>2909</prism:endingPage>
    <prism:category>component</prism:category>
    <prism:category>crlh</prism:category>
    <prism:category>dual-band</prism:category>
    <prism:category>structure</prism:category>
</item>



<item rdf:about="http://www.citeulike.org/user/dcastro/article/1856858">
    <title>Realization of arbitrary dual-band components using an improved CRLH transmission-line model</title>
    <link>http://www.citeulike.org/user/dcastro/article/1856858</link>
    <description>&lt;i&gt;Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings, Vol. 1 (2005), 4 pp..&lt;/i&gt;&lt;br /&gt;&lt;br /&gt;In this paper, new structures with nonlinear phase responses are proposed based on the composite right /left-handed (CRLH) transmission lines. Using such improved CRLH structure, arbitrary dual-band microstrip components have been realized, such as a quarter-wavelength open/short-circuited stub, and a dual-band branch-line coupler, etc. This has been demonstrated by both simulated and measured results. Compared to the conventional CRLH structures, the novel components are more compact and are easier to be realized.</description>
    <dc:title>Realization of arbitrary dual-band components using an improved CRLH transmission-line model</dc:title>

    <dc:creator>Xian Lin</dc:creator>
    <dc:creator>Ruo Liu</dc:creator>
    <dc:creator>Xin Yang</dc:creator>
    <dc:creator>Ji Chen</dc:creator>
    <dc:creator>Xiao Yin</dc:creator>
    <dc:creator>Qiang Cheng</dc:creator>
    <dc:creator>Tie Cui</dc:creator>
    <dc:source>Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings, Vol. 1 (2005), 4 pp..</dc:source>
    <dc:date>2007-11-02T17:41:40-00:00</dc:date>
    <prism:publicationYear>2005</prism:publicationYear>
    <prism:publicationName>Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings</prism:publicationName>
    <prism:volume>1</prism:volume>
    <prism:startingPage>4 pp.</prism:startingPage>
    <prism:category>component</prism:category>
    <prism:category>crlh</prism:category>
    <prism:category>dual-band</prism:category>
    <prism:category>model</prism:category>
</item>



</rdf:RDF>

