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Tag cl2-o2 [11 articles]

Recent papers classified by the tag cl2-o2.
  • notes Etching of ruthenium coatings in O[sub 2]- and Cl[sub 2]-containing plasmas
    Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 24, No. 1. (2006), pp. 1-8.
    by CC Hsu, JW Coburn, DB Graves
    posted to cl2-o2 plasma ruthenium by these_morel on 2006-02-28 15:18:11 as ** along with 1 group LTM_LETI_etching
  • Plasma–wall interactions during silicon etching processes in high-density HBr/Cl2/O2 plasmas
    Plasma Sources Science and Technology, Vol. 14, No. 2. (2005), pp. S42-S52.
    posted to absorption cl2-o2 parois plasma by these_morel on 2008-03-05 09:11:32 as read
  • notes Molybdenum gate technology for ultrathin-body MOSFETs and FinFETs
    Electron Devices, IEEE Transactions on, Vol. 51, No. 12. (2004), pp. 1989-1996.
    by Daewon Ha, H Takeuchi, Yang-Kyu Choi, Tsu-Jae King
  • notes Radio frequency plasma etching of Si/SiO[sub 2] by Cl[sub 2]/O[sub 2] : Improvements resulting from the time modulation of the processing gases
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 8, No. 6. (1990), pp. 1185-1191.
    by SC Mcnevin
  • Influence of reactor walls on plasma chemistry and on silicon etch product densities during silicon etching processes in halogen-based plasmas
    Plasma Sources Science and Technology, Vol. 13, No. 3. (2004), pp. 522-530.
    posted to absorption cl2 cl2-o2 dissociation etching parois plasma silicon by these_morel on 2008-03-05 09:13:22 as read
  • Analysis of the UV absorption spectrum of ClO: a comparative study of four methods for spectral computations
    Journal of Quantitative Spectroscopy and Radiative Transfer, Vol. 62, No. 3. (June 1999), pp. 345-369.
    by D Maric, JP Burrows
    posted to absorption cl2-o2 clo by these_morel on 2008-04-10 07:45:00 as ***
  • notes Investigation of etching properties of HfO based high-K dielectrics using inductively coupled plasma
    Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 22, No. 4. (2004), pp. 1552-1558.
    by Jinghao Chen, Won J Yoo, Zerlinda YL Tan, Yingqian Wang, Daniel SH Chan
  • notes Mass spectrometry studies of resist trimming processes in HBr/O[sub 2] and Cl[sub 2]/O[sub 2] chemistries
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 23, No. 1. (2005), pp. 103-112.
    by E Pargon, O Joubert, T Chevolleau, G Cunge, Songlin Xu, Thorsten Lill
  • notes Control of etching-product-dependent shape and selectivity in gate polysilicon reactive ion etching
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 16, No. 3. (1998), pp. 1038-1042.
    by Masaaki Sato, Yoshinobu Arita
  • Characterization of resist-trimming processes by quasi in situ x-ray photoelectron spectroscopy
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 22, No. 4. (2004), pp. 1869-1879.
    by E Pargon, O Joubert, Songlin Xu, Thorsten Lill
    posted to cl2-o2 hbr-o2 resist-trimming by these_morel to the group LTM_LETI_etching on 2006-02-17 15:14:13 as read
  • Inductively coupled Cl2/O2 plasma: experimental investigation and modelling
    Vacuum, Vol. 75, No. 11-12. (2004), pp. 237-246.
    by Efremov, Dong-Pyo Kim, Chang-Il Kim
    posted to cl2-o2 icp optical-emission-spectroscopy by these_morel to the group LTM_LETI_etching on 2008-01-30 13:06:03 as read
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