Tag packaging [29 articles] Export

Recent papers classified by the tag packaging.

	Help or Hindrance: The Use of Tools for Opening Packaging [My Copy] Designing Inclusive Futures (2008), pp. 65-74. by A. Yoxall, J. Langley, J. Luxmoore, R. Janson, J. C. Taylor, J. Rowson posted to search-b005 packaging older-adults by lucybuykx on 2009-10-30 15:52:52 as
	Estrogenic potency of food-packaging-associated plasticizers and antioxidants as detected in ERalpha and ERbeta reporter gene cell lines. [My Copy] Journal of agricultural and food chemistry, Vol. 54, No. 12. (14 June 2006), pp. 4407-4416. by M. G. ter Veld, B. Schouten, J. Louisse, et al.D. S. van Es, P. T. van der Saag, I. M. Rietjens, A. J. Murk posted to estrogenicity packaging sources thelist superlist by Zephyrus on 2009-06-27 20:41:29 as
	A low-temperature thin-film electroplated metal vacuum package [My Copy] Microelectromechanical Systems, Journal of In Microelectromechanical Systems, Journal of, Vol. 13, No. 2. (2004), pp. 147-157. by B. H. Stark, K. Najafi posted to packaging by wongmld on 2009-06-24 06:10:13 as along with 1 person z3phyr
	Thermal Isolation of Encapsulated MEMS Resonators [My Copy] Microelectromechanical Systems, Journal of In Microelectromechanical Systems, Journal of, Vol. 17, No. 1. (2008), pp. 175-184. by C. M. Jha, M. A. Hopcroft, S. A. Chandorkar, et al.J. C. Salvia, M. Agarwal, R. N. Candler, R. Melamud, Bongsang Kim, T. W. Kenny posted to packaging thermal by wongmld on 2009-06-24 06:09:40 as along with 1 person z3phyr
	Metal-organic thin-film encapsulation for MEMS [My Copy] Journal of Micromechanics and Microengineering, Vol. 18, No. 10. (2008), 105002. by J. Fang, J. Fu, F. Ayazi posted to packaging by wongmld on 2009-06-24 06:08:48 as along with 1 person z3phyr
	Transponder packaging techniques in radio frequency identification systems [My Copy] Microwave Conference, 1999 Asia Pacific, Vol. 3 (1999), pp. 956-957 vol.3. by M. J. Brady, Dah W. Duan, K. V. S. Rao posted to packaging rfid by wongmld on 2009-06-24 06:05:37 as along with 1 person and 1 group hugomallinson CDAC
	Power and Interface Features of Thermosonic Flip-Chip Bonding [My Copy] Advanced Packaging, IEEE Transactions on In Advanced Packaging, IEEE Transactions on, Vol. 31, No. 3. (2008), pp. 442-446. by Junhui Li, Lei Han, Jue Zhong posted to packaging thermal by wongmld on 2009-06-24 06:03:55 as along with 1 person z3phyr
	Effects of ripening conditions on the texture of Gouda cheese [My Copy] International Journal of Food Science and Technology, Vol. 35, No. 2. (March 2000), pp. 207-214. by Nora C. Bertola, Alicia N. Califano, Alicia E. Bevilacqua, Noemi E. Zaritzky posted to cheese degradation film making packaging plastic properties protein rheological texture manufacturing laborkaese by Tomste on 2009-03-25 16:49:43 as
	A polymer-based microfluidic device for immunosensing biochips [My Copy] Lab Chip, Vol. 3, No. 2. (2003), pp. 106-113. by Jong S. Ko, Hyun C. Yoon, Haesik Yang, et al.Hyeon-Bong Pyo, Kwang H. Chung, Sung J. Kim, Youn T. Kim posted to packaging by freddan on 2009-03-05 12:23:40 as along with 1 person bescarff
	Interconnected reversible lab-on-a-chip technology [My Copy] Lab Chip, Vol. 2, No. 2. (2002), pp. 65-69. by E. Igata, M. Arundell, H. Morgan, J. M. Cooper posted to interconnects packaging by freddan on 2009-03-05 12:18:39 as
	A high-pressure interconnect for chemical microsystem applications [My Copy] Lab Chip, Vol. 1, No. 2. (2001), pp. 148-152. by V. Nittis, R. Fortt, C. H. Legge, De A. J. Mello posted to interconnects packaging by freddan on 2009-03-05 12:12:52 as
	Macro-to-micro interfaces for microfluidic devices [My Copy] Lab Chip, Vol. 4, No. 6. (2004), pp. 526-533. by Carl K. Fredrickson, Z. Hugh Fan posted to interconnects packaging by freddan on 2009-03-05 12:12:08 as along with 1 person ImranRaoufMalik
	Energy Landscape for DNA Rotation and Sliding through a Phage Portal. [My Copy] Biophysical journal, Vol. 96, No. 4. (18 February 2009) by Jeremiah Nummela, Ioan Andricioaei posted to dna mechanism nummel09pdf packaging phage by paulschlesinger on 2009-02-18 19:24:22 as
	Stoichiometry of the antiviral protein APOBEC3G in HIV-1 virions. [My Copy] Virology, Vol. 360, No. 2. (10 April 2007), pp. 247-256. by H. Xu, E. Chertova, J. Chen, et al.D. E. Ott, J. D. Roser, W. S. Hu, V. K. Pathak posted to apobec packaging by kieran101 on 2008-11-26 10:37:45 as
	Oestrogenicity of paper and cardboard extracts used as food containers [My Copy] Food Additives & Contaminants: Part A: Chemistry, Analysis, Control, Exposure & Risk Assessment, Vol. 24, No. 1. (2007), pp. 95-102. by Lopez-Espinosa, A. Granada, P. Araque, et al. Molina-Molina, Puertollano, A. Rivas, M. Fernández, I. Cerrillo, Olea-Serrano, C. López, N. Olea posted to cardboard e-screen estrogen packaging thesis by Zephyrus to the group Breast Cancer Reading Club on 2008-10-03 21:53:54 as
	Characterization of low-temperature wafer bonding using thin-film parylene [My Copy] Microelectromechanical Systems, Journal of In Microelectromechanical Systems, Journal of, Vol. 14, No. 6. (2005), pp. 1347-1355. by H. Kim, K. Najafi posted to bonding packaging parylene polymer by z3phyr on 2008-08-26 18:13:41 as
	A Generic Environment-Resistant Packaging Technology for MEMS [My Copy] Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International In Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International (2007), pp. 335-338. by S. H. Lee, S. W. Lee, K. Najafi posted to mems packaging by z3phyr on 2008-08-20 21:43:26 as
	Hermeticity testing of capacitive RF MEMS switches [My Copy] Reliability Physics Symposium, 2008. IRPS 2008. IEEE International In Reliability Physics Symposium, 2008. IRPS 2008. IEEE International (2008), pp. 691-692. by P. J. van der Wel, J. Stulemeijer, J. A. Bielen, et al.F. G. A. Theunis, A. den Dekker, M. A. J. van Gils, R. J. Havens posted to hermetic mems packaging testing by z3phyr on 2008-08-20 04:13:58 as
	Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package With Vertical Feedthroughs [My Copy] Microelectromechanical Systems, Journal of In Microelectromechanical Systems, Journal of, Vol. 17, No. 1. (2008), pp. 193-200. by Junseok Chae, J. M. Giachino, K. Najafi posted to mems packaging by z3phyr on 2008-08-19 06:51:31 as
	The importance of packaging attributes: a conjoint analysis approach [My Copy] European Journal of Marketing, Vol. 41, No. 11-12. (2007), pp. 1495-1517. by Silayoi, Pinya, Speece, Mark posted to attributes importance of packaging the by rasielx on 2008-07-27 16:55:38 as
	Radio frequency identification (RFID) performance: the effect of tag orientation and package contents [My Copy] Packaging Technology and Science, Vol. 19, No. 1. (2006), pp. 45-54. by Robert H. Clarke, Diana Twede, Jeffrey R. Tazelaar, Kenneth K. Boyer posted to liquid methodology orientation packaging stacking tag_placement testing by hugomallinson on 2008-07-17 18:03:34 as
	Public acceptance of nanotechnology foods and food packaging: the influence of affect and trust [My Copy] Appetite, Vol. 49, No. 2. (September 2007), pp. 459-466. by Michael Siegrist, Marie-Eve Cousin, Hans Kastenholz, Arnim Wiek posted to acceptance affect food hazards heuristic nanotechnology packaging perception public risk trust by nikko on 2008-05-13 19:34:45 as
	Low Cost Passive UHF RFID Packaging with Electromagnetic Band Gap (EBG) Substrate for Metal Objects [My Copy] Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th In Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th (2007), pp. 974-978. by Bo Gao, Chi H. Cheng, M. M. F. Yuen, R. D. Murch posted to modeling rfid insulation metal packaging performance by hugomallinson on 2008-03-05 09:01:24 as
	Defining product stewardship and sustainability in the Australian packaging industry [My Copy] Environmental Science & Policy, Vol. 8, No. 1. (February 2005), pp. 45-55. by Helen Lewis posted to discourse packaging product stewardship sustainability by nvexler on 2007-10-14 03:39:10 as
	Packaging performance comparison for distribution and export of papaya fruit [My Copy] Packaging Technology and Science, Vol. 18, No. 3. (May 2005), pp. 125-131. by Vanee Chonhenchob, S. Paul Singh posted to packaging by Hayama on 2006-12-20 02:23:57 as along with 1 person granville
	Postweld-Shift-Induced Fiber Alignment Shifts in Laser-Welded Laser Module Packages: Experiments and Simulations [My Copy] Lightwave Technology, Journal of, Vol. 23, No. 12. (2005), pp. 4287-4295. by Y. C. Hsu, Y. C. Tsai, J. H. Kuang, W. H. Cheng posted to packaging welding by chrisada on 2006-02-03 01:44:24 as
	Low-Cost 10-Gb/s Optical Receiver Module Using a Novel Plastic Package and a Passive Alignment Technique [My Copy] Lightwave Technology, Journal of, Vol. 23, No. 12. (2005), pp. 4257-4264. by T. Kurosaki, Y. Shuto, T. Tadokoro, et al.K. Yokoyama, J. Endo, M. Amano, M. Nakamura, N. Ishihara, Y. Suzuki posted to 10gbps alignment gaas integration packaging by chrisada on 2006-02-03 01:39:28 as
	Translocation of Nicked but not Gapped DNA by the Packaging Motor of Bacteriophage phi29 [My Copy] Journal of Molecular Biology, Vol. 351, No. 1. (5 August 2005), pp. 100-107. by Wulf-Dieter Moll, Peixuan Guo posted to nicking packaging phi29 by ruudvanleeuwen on 2005-11-22 16:42:45 as
	Identification of Peptide Ligands for Target RNA Structures Derived from the HIV-1 Packaging Signal [My Copy] ChemBioChem, Vol. 4, No. 10. (26 September 2003), pp. 1093-1097. by Anette Pustowka, Julia Dietz, Jan Ferner, et al.Michael Baumann, Dr, Margot Landersz, Christoph Königs, Harald Schwalbe, Dr, Ursula Dietrich, Dr posted to display hiv-1 interactions packaging peptides phage rna rna-peptide by P2324548 on 2005-06-08 15:30:08 as

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heat_transfer	13
thermal_management	11
mems	10
cooling	8
heat_exchangers	8
heat_sinks	6
cpu	5
moores_law	5
anodic_bonding	4
cmos	4
heat_pipes	4
interconnects	4
microfabrication	4
vlsi	4
dielectric	3
food	3
microchannels	3
tantalum_oxide	3
thin_film	3
waferbonding	3
applications	2
closed_loop_systems	2
clsc	2
film	2
fusionbonding	2
hermetic	2
microprocessor	2
phage	2
review	2
rfid	2
testing	2
text_book	2
thermal	2
thermal_management_issues	2
3d_integration	1
affect	1
alignment	1
apobec	1
attributes	1
automotive	1
bonding	1
bulk_micromachining	1
cardboard	1
chemical_sensors	1
degradation	1
diffusion	1
display	1
dna	1
estrogen	1
estrogenicity	1
feedblock_profiling	1
gaas	1
heuristic	1
hiv-1	1
insulation	1
interactions	1
laborkaese	1
liquid	1
manufacturing	1
materials	1
measurement	1
metal	1
microelectronics	1
micromachining	1
modeling	1
multicore	1
nicking	1
nummel09pdf	1
of	1
older-adults	1
orientation	1
osmosis	1
parylene	1
peptides	1
phi29	1
plastic	1
polymer	1
pressure_sensors	1
properties	1
protein	1
public	1
resistance	1
rheological	1
risk	1
rna-peptide	1
scaling	1
search-b005	1
silicon	1
single_phase_heat_transfer	1
sources	1
stacking	1
sustainability	1
temperature_sensor	1
test_structure	1
texture	1
thelist	1
thermal_resistance	1
thermosonic	1
via	1
wafer_stack	1

Tag packaging [29 articles] Export

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