High ductility of a metal film adherent on a polymer substrate Export

@article{citeulike:587300, abstract = {In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10\% without appreciable cracks and up to 30\% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2\%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates. {\copyright}2005 American Institute of Physics}, author = {Xiang, Yong and Li, Teng and Suo, Zhigang and Vlassak, Joost J.}, citeulike-article-id = {587300}, citeulike-linkout-0 = {http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=APPLAB000087000016161910000001&idtype=cvips&gifs=yes}, citeulike-linkout-1 = {http://link.aip.org/link/?APL/87/161910}, citeulike-linkout-2 = {http://dx.doi.org/10.1063/1.2108110}, comment = {The ductility of thin metal film is sensitive to its adhesion to the underlying polymer substrate.}, doi = {10.1063/1.2108110}, journal = {Applied Physics Letters}, keywords = {adhesion, ductility, experiment, flexible-electronics, macroelectronics, mechanics, polymer-substrate, thin-metal-film}, number = {16}, posted-at = {2006-07-01 15:40:16}, priority = {5}, publisher = {AIP}, title = {High ductility of a metal film adherent on a polymer substrate}, url = {http://dx.doi.org/10.1063/1.2108110}, volume = {87}, year = {2005} }

TY - JOUR ID - citeulike:587300 L3 - citeulike-article-id:587300 N2 - In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates. ©2005 American Institute of Physics IS - 16 JF - Applied Physics Letters TI - High ductility of a metal film adherent on a polymer substrate PB - AIP VL - 87 KW - adhesion KW - ductility KW - experiment KW - flexible-electronics KW - macroelectronics KW - mechanics KW - polymer-substrate KW - thin-metal-film N1 - The ductility of thin metal film is sensitive to its adhesion to the underlying polymer substrate. AU - Xiang, Yong AU - Li, Teng AU - Suo, Zhigang AU - Vlassak, Joost PY - 2005/// UR - http://dx.doi.org/10.1063/1.2108110 ER -