A transparent, high barrier, and high heat substrate for organic electronics Export

@article{citeulike:731631, abstract = {The use of plastic film substrates for organic electronic devices promises to enable new applications, such as flexible displays and conformal lighting, and a new low-cost paradigm through high-volume roll-to-roll fabrication. Unfortunately, presently available substrates cannot yet deliver this promise because of the challenge in achieving the required combination of optical transparency, impermeability to water and oxygen, mechanical flexibility, high-temperature capability, and chemical resistance. Here, we describe the development and performance of a plastic substrate comprising a high heat polycarbonate film combined with a unique transparent coating package that is aimed at meeting this challenge.}, author = {Yan, Min and Kim, Tae W. and Erlat, A. G. and Pellow, M. and Foust, D. F. and Liu, Jie and Schaepkens, M. and Heller, C. M. and Mcconnelee, P. A. and Feist, T. P. and Duggal, A. R.}, citeulike-article-id = {731631}, citeulike-linkout-0 = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1468603}, journal = {Proceedings of the IEEE}, keywords = {experiment, flexible-electronics, macroelectronics, materials}, number = {8}, pages = {1468--1477}, posted-at = {2006-07-03 02:44:35}, priority = {2}, title = {A transparent, high barrier, and high heat substrate for organic electronics}, url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1468603}, volume = {93}, year = {2005} }

TY - JOUR ID - citeulike:731631 L3 - citeulike-article-id:731631 N2 - The use of plastic film substrates for organic electronic devices promises to enable new applications, such as flexible displays and conformal lighting, and a new low-cost paradigm through high-volume roll-to-roll fabrication. Unfortunately, presently available substrates cannot yet deliver this promise because of the challenge in achieving the required combination of optical transparency, impermeability to water and oxygen, mechanical flexibility, high-temperature capability, and chemical resistance. Here, we describe the development and performance of a plastic substrate comprising a high heat polycarbonate film combined with a unique transparent coating package that is aimed at meeting this challenge. IS - 8 JF - Proceedings of the IEEE EP - 1477 TI - A transparent, high barrier, and high heat substrate for organic electronics VL - 93 SP - 1468 KW - experiment KW - flexible-electronics KW - macroelectronics KW - materials AU - Yan, Min AU - Kim, Tae AU - Erlat, AG AU - Pellow, M AU - Foust, DF AU - Liu, Jie AU - Schaepkens, M AU - Heller, CM AU - Mcconnelee, PA AU - Feist, TP AU - Duggal, AR PY - 2005/// UR - http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1468603 ER -