| |
Electron Device Letters, IEEE, Vol. 25, No. 6. (2004), pp. 408-410.
|
| |
Solid State Phenomena, Vol. 103-104 (2005), pp. 93-96.
by M. Claes, V. Paraschiv, S. Beckx, et al.M. Demand, W. Deweerd, S. Garaud, H. Kraus, R. Vos, J. Snow, W. Boullart, S. De Gendt
|
| |
|
| |
Journal of the Korean Physical Society, Vol. 43, No. 4. (October 2003), pp. 526-528.
|
| |
Japanese Journal of Applied Physics, Vol. 45, No. 10. (2006), pp. L297-L300.
|
| |
Thin Solid Films, Vol. 447-448 (30 January 2004), pp. 586-591.
|
| |
Journal of Applied Physics, Vol. 70, No. 6. (1991), pp. 3314-3323.
|
| |
Microelectronic Engineering, Vol. 65, No. 3. (March 2003), pp. 285-292.
|
| |
In SEMI Technical Symposium (2003)
|
| |
Journal of Applied Physics, Vol. 66, No. 10. (1989), pp. 5034-5038.
|
| |
Microelectronic Engineering In Micro- and Nano-Engineering MNE 2005, Vol. 83, No. 4-9. ( 2006), pp. 1159-1162.
|
| |
Thin Solid Films, Vol. 320, No. 1. (4 May 1998), pp. 147-150.
|
| |
Microelectronic Engineering In Micro- and Nano-Engineering MNE 2005, Vol. 83, No. 4-9. ( 2006), pp. 1152-1154.
|
| |
Device Research Conference, 2001 (2001), 73.
|