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Microstructural Analysis of Sintered High-Conductivity Zirconia with Al203 Additionsby: E. P. Butler, J. Drennan
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AbstractTransmission electron microscopy (at 100 and 1000 kV potential) and analytical scanning transmission electron microscopy were used to study alpha-Al203 second-phase particles and their interactions with grain boundaries in two high-conductivity Y203/Yb203 stabilized zirconia ceramics containing deliberate additions of the alumina as a sintering aid. Most of the Al203 particles were intragranular and microanalysis showed that they contained inclusions rich in Zr or Si plus Zr. Al2O3 particles at grain boundaries were frequently associated with amorphous cusp areas rich in Si and Al. The results suggest that the Al203 acts as a scavenger for SiO2, removing it from grain-boundary localities. A model is proposed whereby this process occurs as the boundaries meet the second-phase particles, assisted by rapid grain-boundary diffusion. Such an ZrO2-Al2O3-SiO2 interaction and partitioning is predicted thermodynamically and offers a possible explanation for the improvements in ionic conductivity brought about by Al2O3 additions, as reported in the literature.
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