In situ observation of cracks in gold nano-interconnects on flexible substrates Export

@article{citeulike:3154083, abstract = {Metallic conductors on polymeric substrates are frequently used for printed circuit boards or flexible displays. Optimization of these devices is mostly associated with the miniaturization of the conductors which changes their electrical and mechanical properties. We focus on crack formation in gold nano-interconnects about 20 nm high, 40 nm wide and 1 mm long on flexible substrates. The fracture toughness of the gold nanolines is decreased significantly compared to bulk gold.}, author = {Olliges, Sven and Gruber, Patric A. and Orso, Steffen and Auzelyte, Vaida and Ekinci, Yasin and Solak, Harun H. and Spolenak, Ralph}, citeulike-article-id = {3154083}, citeulike-linkout-0 = {http://dx.doi.org/10.1016/j.scriptamat.2007.09.037}, citeulike-linkout-1 = {http://www.sciencedirect.com/science/article/B6TY2-4R05JG1-5/2/79a0e1209a43ecf4a136a5ced1462037}, doi = {10.1016/j.scriptamat.2007.09.037}, journal = {Scripta Materialia}, keywords = {ductility, experiment, flexible-electronics, polymer-substrate, thin-metal-film}, month = {February}, number = {3}, pages = {175--178}, posted-at = {2008-08-25 19:49:48}, priority = {2}, title = {In situ observation of cracks in gold nano-interconnects on flexible substrates}, url = {http://dx.doi.org/10.1016/j.scriptamat.2007.09.037}, volume = {58}, year = {2008} }

TY - JOUR ID - citeulike:3154083 L3 - citeulike-article-id:3154083 N2 - Metallic conductors on polymeric substrates are frequently used for printed circuit boards or flexible displays. Optimization of these devices is mostly associated with the miniaturization of the conductors which changes their electrical and mechanical properties. We focus on crack formation in gold nano-interconnects about 20 nm high, 40 nm wide and 1 mm long on flexible substrates. The fracture toughness of the gold nanolines is decreased significantly compared to bulk gold. IS - 3 JF - Scripta Materialia EP - 178 TI - In situ observation of cracks in gold nano-interconnects on flexible substrates VL - 58 SP - 175 KW - ductility KW - experiment KW - flexible-electronics KW - polymer-substrate KW - thin-metal-film AU - Olliges, Sven AU - Gruber, Patric AU - Orso, Steffen AU - Auzelyte, Vaida AU - Ekinci, Yasin AU - Solak, Harun AU - Spolenak, Ralph PY - 2008/02// UR - http://dx.doi.org/10.1016/j.scriptamat.2007.09.037 ER -