A high-sensitivity polyimide humidity sensor for monitoring hermetic micropackages Export

@inproceedings{citeulike:816185, abstract = {This paper presents the fabrication and characterization of a high-sensitivity polyimide-based humidity sensor for monitoring internal humidity level in anodically-bonded hermetic micropackages. This capacitive sensor is 1 mm on a side, and utilizes CU1512 polyimide film with a thickness in the range of 300-1200 \Å sandwiched between 2 metal electrodes to sense moisture. The measured sensitivity for a sensor with a 1200 \Å-thick film is 0.86 pF/\%RH, and for a 300 \Å-thick sensor is 3.4 pF/\%RH. The sensor has been exposed to and survived a one-hour test at 400\°C, which is the temperature typically used to perform anodic bonding. Measurements show an offset drift of less than 1\% RH at 50\% RH and 37\°C, and a hysteresis of \<2\% RH over a range of 30-70\% RH for a 1200 \Å-thick polyimide film sensor}, author = {Dokmeci, M. and Najafi, K.}, citeulike-article-id = {816185}, citeulike-linkout-0 = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=746835}, journal = {Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on}, keywords = {polyimide}, pages = {279--284}, posted-at = {2006-08-25 04:46:08}, priority = {2}, title = {A high-sensitivity polyimide humidity sensor for monitoring hermetic micropackages}, url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=746835}, year = {1999} }

TY - CONF ID - citeulike:816185 L3 - citeulike-article-id:816185 N2 - This paper presents the fabrication and characterization of a high-sensitivity polyimide-based humidity sensor for monitoring internal humidity level in anodically-bonded hermetic micropackages. This capacitive sensor is 1 mm on a side, and utilizes CU1512 polyimide film with a thickness in the range of 300-1200 Å sandwiched between 2 metal electrodes to sense moisture. The measured sensitivity for a sensor with a 1200 Å-thick film is 0.86 pF/%RH, and for a 300 Å-thick sensor is 3.4 pF/%RH. The sensor has been exposed to and survived a one-hour test at 400°C, which is the temperature typically used to perform anodic bonding. Measurements show an offset drift of less than 1% RH at 50% RH and 37°C, and a hysteresis of <2% RH over a range of 30-70% RH for a 1200 Å-thick polyimide film sensor JF - Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on EP - 284 TI - A high-sensitivity polyimide humidity sensor for monitoring hermetic micropackages SP - 279 KW - polyimide AU - Dokmeci, M AU - Najafi, K PY - 1999/// UR - http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=746835 ER -