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A model for optimizing the assembly and disassembly of electronic systems

Electronics Packaging Manufacturing, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part C: Manufacturing, IEEE Transactions on], Vol. 22, No. 2. (1999), pp. 105-117.

by P. A. Sandborn, C. F. Murphy

posted to design by corinnerw on 2006-12-04 07:05:39 as

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