Direct writing of copper conductive patterns by ink-jet printing Export

@article{Park7711, abstract = {Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40–50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.}, author = {Park, B. and Kim, D. and Jeong, S. and Moon, J. and Kim, J.}, citeulike-article-id = {4636726}, citeulike-linkout-0 = {http://dx.doi.org/10.1016/j.tsf.2006.11.142}, citeulike-linkout-1 = {http://linkinghub.elsevier.com/retrieve/pii/S0040609006014167}, comment = {Copper nanoparticles air-stable thanks to polymer capping; low conductivity at T anneal > 250 degC}, day = {16}, doi = {10.1016/j.tsf.2006.11.142}, issn = {00406090}, journal = {Thin Solid Films}, keywords = {copper, ink, ink-jet, nanoparticle, oxidation}, month = {July}, number = {19}, pages = {7706--7711}, posted-at = {2009-05-26 17:27:55}, priority = {2}, title = {Direct writing of copper conductive patterns by ink-jet printing}, url = {http://dx.doi.org/10.1016/j.tsf.2006.11.142}, volume = {515}, year = {2007} }

TY - JOUR ID - Park7711 L3 - citeulike-article-id:4636726 N2 - Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40–50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum. IS - 19 JF - Thin Solid Films SN - 00406090 EP - 7711 TI - Direct writing of copper conductive patterns by ink-jet printing VL - 515 SP - 7706 KW - copper KW - ink KW - ink-jet KW - nanoparticle KW - oxidation N1 - Copper nanoparticles air-stable thanks to polymer capping; low conductivity at T anneal > 250 degC AU - Park, B AU - Kim, D AU - Jeong, S AU - Moon, J AU - Kim, J PY - 2007/07/16/ UR - http://dx.doi.org/10.1016/j.tsf.2006.11.142 ER -