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Three-Dimensional Deformation Measurement from the Combination of In-Plane and Out-Of-Plane Electronic Speckle Pattern Interferometers Export

Appl. Opt., Vol. 43, No. 24. (2004), pp. 4652-4658.

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An optical setup that can be switched to produce in-plane and out-of-plane sensitivity interferometers was designed for three-dimensional deformation measuring by electronic speckle pattern interferometry. Divergent illumination is considered in the evaluation of sensitivity vectors to measure both in-plane and out-of-plane displacement components. The combination of these interferometers presents the advantage of greater sensitivity in directions u, v, and w than a typical interferometer with three illumination beams provides. The system and its basic operation are described, and results with an elastic target that is exposed to a mechanical load are reported.


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