Micropatterning of Organic Electronic Devices by Cold-Welding Export

@article{citeulike:3910066, abstract = {10.1126/science.288.5467.831}, author = {Kim, Changsoon and Burrows, Paul E. and Forrest, Stephen R.}, citeulike-article-id = {3910066}, citeulike-linkout-0 = {http://dx.doi.org/10.1126/science.288.5467.831}, citeulike-linkout-1 = {http://www.sciencemag.org/cgi/content/abstract/288/5467/831}, citeulike-linkout-2 = {http://view.ncbi.nlm.nih.gov/pubmed/10796998}, citeulike-linkout-3 = {http://www.hubmed.org/display.cgi?uids=10796998}, day = {5}, doi = {10.1126/science.288.5467.831}, journal = {Science}, keywords = {confirmation, welding}, month = {May}, number = {5467}, pages = {831--833}, posted-at = {2009-01-20 07:31:30}, priority = {2}, title = {Micropatterning of Organic Electronic Devices by Cold-Welding}, url = {http://dx.doi.org/10.1126/science.288.5467.831}, volume = {288}, year = {2000} }

TY - JOUR ID - citeulike:3910066 L3 - citeulike-article-id:3910066 N2 - 10.1126/science.288.5467.831 IS - 5467 JF - Science EP - 833 TI - Micropatterning of Organic Electronic Devices by Cold-Welding VL - 288 SP - 831 KW - confirmation KW - welding AU - Kim, Changsoon AU - Burrows, Paul AU - Forrest, Stephen PY - 2000/05/05/ UR - http://dx.doi.org/10.1126/science.288.5467.831 ER -