Proceedings of the IEEE, Vol. 93, No. 7. (2005), pp. 1321-1329.
Proceedings of the IEEE, Vol. 93, No. 7. (2005), pp. 1348-1356.
Proceedings of the IEEE, Vol. 93, No. 8. (2005), pp. 1394-1399.
Proceedings of the IEEE, Vol. 93, No. 8. (2005), pp. 1400-1406.
Proceedings of the IEEE, Vol. 93, No. 8. (2005), pp. 1407-1411.
Proceedings of the IEEE, Vol. 93, No. 8. (2005), pp. 1429-1439.
Proceedings of the IEEE, Vol. 93, No. 8. (2005), pp. 1483-1490.
Proceedings of the IEEE, Vol. 93, No. 8. (2005), pp. 1500-1510.
Proceedings of the IEEE, Vol. 93, No. 8. (2005), pp. 1491-1499.
Materials Research Society Bulletin, Vol. 31, No. 6. (June 2006)
Nature, Vol. 428, No. 6986. (29 April 2004), pp. 911-918.
Solar Energy, Vol. 80, No. 6. (June 2006), pp. 687-693.
Materials Today, Vol. 9, No. 4. (April 2006), pp. 32-37.
Non-Volatile Semiconductor Memory Workshop, 2006. IEEE NVSMW 2006. 21st (2006), pp. 9-11.
Emerging Lithographic Technologies X, Vol. 6151, No. 1. (2006)
Emerging Lithographic Technologies IX, Vol. 5751, No. 1. (2005), pp. 248-259.
Journal of Microlithography, Microfabrication, and Microsystems, Vol. 5, No. 3. (2006)
Advances in Resist Technology and Processing XXII, Vol. 5753, No. 1. (2005), pp. 827-835.
Emerging Lithographic Technologies X, Vol. 6151, No. 1. (2006)
by Bjorn AM
Hansson, Igor V
Fomenkov, Norbert R
Bowering, Alex I
Ershov, William N
Partlo, David W
Myers, Oleh V
Khodykin, Alexander N
Bykanov, Curtis L
Rettig, Jerzy R
Hoffman,
Ernesto, Rod D
Simmons, Juan A
Chavez, William F
Marx, David C
Brandt
Optical Microlithography XVIII, Vol. 5754, No. 1. (2004), pp. 611-621.
MRS Bulletin, Vol. 31, No. 6. (June 2006), pp. 471-475.
Acta Materialia, Vol. 52, No. 10. (7 June 2004), pp. 2973-2987.
Science, Vol. 280 (15 May 1998), pp. 1099-1100.
Ann NY Acad Sci, Vol. 1006, No. 1. (1 December 2003), pp. 212-226.
Vol. 1006
Earth and Planetary Science Letters, Vol. 241, No. 1-2. (15 January 2006), pp. 95-103.
Physical Review B, Vol. 63, No. 17. (29 March 2001), 174103.
Physical Review B (Condensed Matter and Materials Physics), Vol. 67, No. 3. (2003)
Physical Review B, Vol. 62, No. 22. (1 December 2000), 15084.
Physical Review B (Condensed Matter and Materials Physics), Vol. 71, No. 4. (2005)
Physical Review B (Condensed Matter and Materials Physics), Vol. 71, No. 12. (2005)
Physical Review Letters, Vol. 83, No. 2. (12 July 1999), 324.
Physical Review Letters, Vol. 93, No. 17. (2004)
Physical Review Letters, Vol. 75, No. 2. (10 July 1995), 288.
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International (2005), pp. 323-326.
VLSI Circuits, 2005. Digest of Technical Papers. 2005 Symposium on (2005), pp. 156-159.
Electron Device Letters, IEEE, Vol. 27, No. 2. (2006), pp. 127-129.
Electron Device Letters, IEEE, Vol. 27, No. 6. (2006), pp. 486-488.
Electron Devices, IEEE Transactions on, Vol. 52, No. 12. (2005), pp. 2654-2659.
Electron Device Letters, IEEE, Vol. 27, No. 6. (2006), pp. 445-447.
Electron Device Letters, IEEE, Vol. 26, No. 5. (2005), pp. 286-288.
Device and Materials Reliability, IEEE Transactions on, Vol. 4, No. 3. (2004), pp. 422-427.
Electron Device Letters, IEEE, Vol. 25, No. 10. (2004), pp. 684-686.
Electron Device Letters, IEEE, Vol. 25, No. 7. (2004), pp. 507-509.
Electron Devices, IEEE Transactions on, Vol. 51, No. 5. (2004), pp. 714-719.
Electron Devices, IEEE Transactions on, Vol. 51, No. 3. (2004), pp. 452-459.
Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI (2000), pp. 83-88.
VLSI Test Symposium, 19th IEEE Proceedings on. VTS 2001 (2001), pp. 326-332.
Test Conference, 2001. Proceedings. International (2001), pp. 340-347.
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International (1999), pp. 1-11.