PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics TeX Export

@article{citeulike:833473, abstract = {An adhesive bonding technique for wafer-level sealing of SU-8 based lab-on-a-chip microsystems with integrated optical components is presented. Microfluidic channels and optical components, e.g. waveguides, are fabricated in cross-linked SU-8 and sealed with a Pyrex glass substrate by means of an intermediate layer of 950k molecular weight poly-methylmethacrylate (PMMA). Due to a lower refractive index of PMMA ( n = 1.49 at \&lgr; = 600\–900 nm) this bonding technique preserves waveguiding in the cross-linked SU-8 structures ( n = 1.59 at \&lgr; = 633 nm) in combination with good sealing of the microfluidic channels. The bonding strength dependence on bonding temperature and bonding force is investigated. A maximum bonding strength of 16 MPa is achieved at bonding temperatures between 110 \$^\circ\$C and 120 \$^\circ\$C, at a bonding force of 2000 N on a 4 inch wafer. The optical propagation loss of multi-mode 10 \$\mu\$m (thickness) \$\times\$ 30 \$\mu\$m (width) SU-8 waveguides is measured. The propagation loss in PMMA bonded waveguide structures is more than 5 dB cm\$^\−1\$ lower, at wavelengths between 600 nm and 900 nm, than in similar structures bonded by an intermediate layer of SU-8. Furthermore 950k PMMA shows no tendency to flow into the bonded structures during bonding because of its high viscosity.}, author = {Bilenberg, B. and Nielsen, T. and Clausen, B. and Kristensen, A.}, citeulike-article-id = {833473}, citeulike-linkout-0 = {http://dx.doi.org/10.1088/0960-1317/14/6/008}, citeulike-linkout-1 = {http://stacks.iop.org/0960-1317/14/814}, doi = {10.1088/0960-1317/14/6/008}, journal = {Journal of Micromechanics and Microengineering}, keywords = {bonding, microfluidics, pmma, su8}, number = {6}, pages = {814--818}, posted-at = {2008-08-06 13:29:34}, priority = {5}, title = {PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics}, url = {http://dx.doi.org/10.1088/0960-1317/14/6/008}, volume = {14}, year = {2004} }

TY - JOUR ID - citeulike:833473 L3 - citeulike-article-id:833473 N2 - An adhesive bonding technique for wafer-level sealing of SU-8 based lab-on-a-chip microsystems with integrated optical components is presented. Microfluidic channels and optical components, e.g. waveguides, are fabricated in cross-linked SU-8 and sealed with a Pyrex glass substrate by means of an intermediate layer of 950k molecular weight poly-methylmethacrylate (PMMA). Due to a lower refractive index of PMMA ( n = 1.49 at \&lgr; = 600\–900 nm) this bonding technique preserves waveguiding in the cross-linked SU-8 structures ( n = 1.59 at \&lgr; = 633 nm) in combination with good sealing of the microfluidic channels. The bonding strength dependence on bonding temperature and bonding force is investigated. A maximum bonding strength of 16 MPa is achieved at bonding temperatures between 110 $^\circ$C and 120 $^\circ$C, at a bonding force of 2000 N on a 4 inch wafer. The optical propagation loss of multi-mode 10 $\mu$m (thickness) $\times$ 30 $\mu$m (width) SU-8 waveguides is measured. The propagation loss in PMMA bonded waveguide structures is more than 5 dB cm$^\−1$ lower, at wavelengths between 600 nm and 900 nm, than in similar structures bonded by an intermediate layer of SU-8. Furthermore 950k PMMA shows no tendency to flow into the bonded structures during bonding because of its high viscosity. IS - 6 JF - Journal of Micromechanics and Microengineering EP - 818 TI - PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics VL - 14 SP - 814 KW - bonding KW - microfluidics KW - pmma KW - su8 AU - Bilenberg, B AU - Nielsen, T AU - Clausen, B AU - Kristensen, A PY - 2004/// UR - http://dx.doi.org/10.1088/0960-1317/14/6/008 ER -