CiteULike: these_morel's Chevolleau:T [5 articles]

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CiteULike organises scholarly (or academic) papers or literature and provides bibliographic (which means it makes bibliographies) for universities and higher education establishments. It helps undergraduates and postgraduates. People studying for PhDs or in postdoctoral (postdoc) positions. The service is similar in scope to EndNote or RefWorks or any other reference manager like BibTeX, but it is a social bookmarking service for scientists and humanities researchers.

	Etude des mécanismes de gravure du Si à basse température par un faisceau plasma de SF6 extrait d'une source d'ions à décharge micro-onde = Study of the etching of Si at low substrate temperature using a SF6 plasma beam extracted from a microwave ion source [My Copy] (1998) by Thierry Chevolleau posted to dispositifs-experimentaux mass-spectrometry by these_morel on 2008-07-23 09:59:49 as
	Poly-Si/TiN/HfO[sub 2] gate stack etching in high-density plasmas [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 25, No. 3. (2007), pp. 767-778. by A. Le Gouil, O. Joubert, G. Cunge, et al.T. Chevolleau, L. Vallier, B. Chenevier, I. Matko posted to effet-de-charge etching poly-si tin xps by these_morel on 2008-03-05 09:03:24 as
	Etching characteristics of TiN used as hard mask in dielectric etch process [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 24, No. 5. (2006), pp. 2262-2270. by M. Darnon, T. Chevolleau, D. Eon, L. Vallier, J. Torres, O. Joubert posted to titane_nitride xps by these_morel on 2007-02-28 07:59:19 as
	Mass spectrometry studies of resist trimming processes in HBr/O[sub 2] and Cl[sub 2]/O[sub 2] chemistries [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 23, No. 1. (2005), pp. 103-112. by E. Pargon, O. Joubert, T. Chevolleau, G. Cunge, Songlin Xu, Thorsten Lill posted to cl2-o2 hbr-o2 icp mass-spectrometry resist-trimming by these_morel on 2006-03-21 11:34:47 as
	Plasma etching of HfO[sub 2] at elevated temperatures in chlorine-based chemistry [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 24, No. 1. (2006), pp. 30-40. by M. Helot, T. Chevolleau, L. Vallier, et al.O. Joubert, E. Blanquet, A. Pisch, P. Mangiagalli, T. Lill posted to cl2 dielectric etching hfo2 high-k by these_morel on 2006-02-21 09:56:36 as

plasma	54
etching	48
introduction	46
tungsten	45
xps	39
dispositifs-experimentaux	26
high-k	22
hfo2	19
rie	16
cl2	15
tungsten-nitride	15
icp	15
cl2-o2	14
poly-si	13
actinometry	11
microelectronics	11
gate	10
dielectric	9
silicon	9
metal	9
mass-spectrometry	9
cf4	9
fluorocarbon	8
parois	8
metal-gate	8
tin	7
passivation	7
molybdenum	7
absorption	7
cf4-o2	7
fluorine	7
polydepletion	6
sf6	6
reactor	6
plasmas	6
cmos	5
titane_nitride	5
notching	5
resist-trimming	5
tan	5
sf6-n2	5
wsi	5
hbr	5
sf6-ar	5
cleaning	5
sf6-o2	5
annexes	4
sio2	4
hbr-cl2-o2	4
bcl3	4
oxidation	4
nf3	4
ecr	4
wet-etching	4
effet-de-charge	3
volatility	3
ar	3
zro2	3
recess	3
chemical-vapor-deposition	3
decomposition	3
dual-metal-gate	3
dissociation	3
tungsten-oxide	3
work-function	3
tem	3
resistivity	3
temperature	3
tunneling	3
optical-emission-spectroscopy	3
nitrogen	3
nf3-o2	2
hfalo	2
ruthenium	2
titanium	2
deposition	2
doping	2
o2	2
wcl	2
wocl	2
wsix	2
xrr	2
materials	2
chf3	2
polymer_layer	2
c4f8	2
arxps	2
meb	2
microloading	2
hbr-o2	2
bcl3-o2	2
sicl4-cl2	2
cf4-cl2	2
incorporation	2
helicon-plasma	2
cl2-nf3-o2	2
n2	1
thomas	1
hf	1
cf3-cl	1
gravure	1
photoresist	1
nf3-he	1
morel	1
sputter-deposition	1
negative-ion	1
taper	1
c4f8-ar-h2	1
45nm	1
cbrf3	1
dry-etching	1
line-edge-roughness	1
midgap	1
eels	1
tungstene	1
nf3-h2	1
vlsi	1
wcl4	1
hfsio	1
hfn	1
hfsion	1
interconnections	1
oxygen	1
microelectronique	1
3d-integration	1
magnetoplasma	1
silicidation	1
zralo	1
overetch	1
co2	1
bowing	1
gate-patterning	1
pulverisation	1
wco6	1
etchback	1
neural-networks	1
mosi	1
chf3-cl2-bcl3	1
sf6-ar-cl2	1
dhf	1
time-delay-effect	1
angle	1
hfon	1
eot	1
floating_sample	1
co	1
tac	1
new-devices	1
microtrenching	1
aluminium	1
ccl4-o2	1
moores-law	1
wiggling	1
molecular-beam-system	1
damage	1
clo	1
masking-materials	1
nh3	1
eftem	1
selectivity	1
lpcvd	1
uhf-ecr	1
tcp_9400	1
sf6-chf3	1
deformation-resist	1
tcp	1
lam	1
capacitive	1
interferometry	1

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