these_morel's Donnelly:VM [5 articles] Export

Recent papers posted to these_morel's library by the author Donnelly:VM. You can also see everyone's Donnelly:VM.

	Anisotropic etching of SiO[sub 2] in low-frequency CF[sub 4]/O[sub 2] and NF[sub 3]/Ar plasmas [My Copy] Journal of Applied Physics, Vol. 55, No. 1. (1984), pp. 242-252. by V. M. Donnelly, D. L. Flamm, Dautremont W. C. Smith, D. J. Werder posted to actinometry dispositifs-experimentaux nf3 by these_morel on 2008-09-11 08:05:35 as
	Quantitative chemical topography of polycrystalline Si anisotropically etched in Cl[sub 2]/O[sub 2] high density plasmas [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 13, No. 2. (1995), pp. 214-226. by K. V. Guinn, C. C. Cheng, V. M. Donnelly posted to introduction passivation plasma by these_morel on 2008-07-10 15:30:50 as
	The reaction of fluorine atoms with silicon [My Copy] Journal of Applied Physics, Vol. 52, No. 5. (1981), pp. 3633-3639. by Daniel L. Flamm, Vincent M. Donnelly, John A. Mucha posted to introduction plasma by these_morel on 2008-07-04 09:08:59 as
	Etching of high-k dielectric Zr[sub 1 - x]Al[sub x]O[sub y] films in chlorine-containing plasmas [My Copy] The 47th international symposium: Vacuum, thin films, surfaces/interfaces, and processing NAN06, Vol. 19, No. 4. (2001), pp. 1361-1366. by K. Pelhos, V. M. Donnelly, A. Kornblit, et al.M. L. Green, R. B. Van Dover, L. Manchanda, Y. Hu, M. Morris, E. Bower posted to bcl3 cl2 dielectric high-k zralo by these_morel on 2006-02-21 09:50:49 as
	Evaluation of the effectiveness of H[sub 2] plasmas in removing boron from Si after etching of HfO[sub 2] films in BCl[sub 3] plasmas [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 23, No. 2. (2005), pp. 547-553. by C. Wang, V. M. Donnelly posted to bcl3 etching hfo2 plasma by these_morel on 2006-02-17 15:28:10 as

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plasma	54
etching	48
introduction	46
tungsten	45
xps	39
dispositifs-experimentaux	26
high-k	22
hfo2	19
rie	16
cl2	15
tungsten-nitride	15
icp	15
cl2-o2	14
poly-si	13
actinometry	11
microelectronics	11
gate	10
dielectric	9
silicon	9
metal	9
mass-spectrometry	9
cf4	9
fluorocarbon	8
parois	8
metal-gate	8
tin	7
passivation	7
molybdenum	7
absorption	7
cf4-o2	7
fluorine	7
polydepletion	6
sf6	6
reactor	6
plasmas	6
cmos	5
titane_nitride	5
notching	5
resist-trimming	5
tan	5
sf6-n2	5
wsi	5
hbr	5
sf6-ar	5
cleaning	5
sf6-o2	5
annexes	4
sio2	4
hbr-cl2-o2	4
bcl3	4
oxidation	4
nf3	4
ecr	4
wet-etching	4
effet-de-charge	3
volatility	3
ar	3
zro2	3
recess	3
chemical-vapor-deposition	3
decomposition	3
dual-metal-gate	3
dissociation	3
tungsten-oxide	3
work-function	3
tem	3
resistivity	3
temperature	3
tunneling	3
optical-emission-spectroscopy	3
nitrogen	3
nf3-o2	2
hfalo	2
ruthenium	2
titanium	2
deposition	2
doping	2
o2	2
wcl	2
wocl	2
wsix	2
xrr	2
materials	2
chf3	2
polymer_layer	2
c4f8	2
arxps	2
meb	2
microloading	2
hbr-o2	2
bcl3-o2	2
sicl4-cl2	2
cf4-cl2	2
incorporation	2
helicon-plasma	2
cl2-nf3-o2	2
n2	1
thomas	1
hf	1
cf3-cl	1
gravure	1
photoresist	1
nf3-he	1
morel	1
sputter-deposition	1
negative-ion	1
taper	1
c4f8-ar-h2	1
45nm	1
cbrf3	1
dry-etching	1
line-edge-roughness	1
midgap	1
eels	1
tungstene	1
nf3-h2	1
vlsi	1
wcl4	1
hfsio	1
hfn	1
hfsion	1
interconnections	1
oxygen	1
microelectronique	1
3d-integration	1
magnetoplasma	1
silicidation	1
zralo	1
overetch	1
co2	1
bowing	1
gate-patterning	1
pulverisation	1
wco6	1
etchback	1
neural-networks	1
mosi	1
chf3-cl2-bcl3	1
sf6-ar-cl2	1
dhf	1
time-delay-effect	1
angle	1
hfon	1
eot	1
floating_sample	1
co	1
tac	1
new-devices	1
microtrenching	1
aluminium	1
ccl4-o2	1
moores-law	1
wiggling	1
molecular-beam-system	1
damage	1
clo	1
masking-materials	1
nh3	1
eftem	1
selectivity	1
lpcvd	1
uhf-ecr	1
tcp_9400	1
sf6-chf3	1
deformation-resist	1
tcp	1
lam	1
capacitive	1
interferometry	1

these_morel's Donnelly:VM [5 articles] Export

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