these_morel's Oehrlein:GS [6 articles] Export

Recent papers posted to these_morel's library by the author Oehrlein:GS. You can also see everyone's Oehrlein:GS.

	Effect of capacitive coupling on inductively coupled fluorocarbon plasma processing [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 17, No. 6. (1999), pp. 3272-3280. by M. Schaepkens, N. R. Rueger, J. J. Beulens, et al.X. Li, T. E. F. M. Standaert, P. J. Matsuo, G. S. Oehrlein posted to parois pulverisation reactor by these_morel on 2008-12-30 09:11:08 as
	Silicon etching mechanisms in a CF[sub 4]/H[sub 2] glow discharge [My Copy] Journal of Applied Physics, Vol. 62, No. 2. (1987), pp. 662-672. by Gottlieb S. Oehrlein, Holly L. Williams posted to cf4 etching fluorocarbon silicon by these_morel on 2008-09-04 13:20:25 as
	Study of sidewall passivation and microscopic silicon roughness phenomena in chlorine-based reactive ion etching of silicon trenches [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 8, No. 6. (1990), pp. 1199-1211. by G. S. Oehrlein, J. F. Rembetski, E. H. Payne posted to introduction passivation plasma by these_morel on 2008-07-10 15:33:25 as
	Role of fluorocarbon film formation in the etching of silicon, silicon dioxide, silicon nitride, and amorphous hydrogenated silicon carbide [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 22, No. 1. (2004), pp. 53-60. by T. E. F. M. Standaert, C. Hedlund, E. A. Joseph, G. S. Oehrlein, T. J. Dalton posted to fluorocarbon introduction plasma by these_morel on 2008-07-08 06:56:38 as
	Tungsten etching mechanisms in CF[sub 4]/O[sub 2] reactive ion etching plasmas [My Copy] Journal of Applied Physics, Vol. 66, No. 10. (1989), pp. 5034-5038. by Tim D. Bestwick, Gottlieb S. Oehrlein posted to cf4-o2 rie tungsten xps by these_morel on 2006-05-12 09:49:54 as along with 1 person Stanley_vrc
	Competitive reactions of fluorine and oxygen with W, WSi[sub 2], and Si surfaces in reactive ion etching using CF[sub 4]/O[sub 2] [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 7, No. 3. (1989), pp. 1035-1041. by Gottlieb S. Oehrlein, Lennart J. Lindstom posted to cf4-o2 etching plasma rie tungsten wsi by these_morel on 2006-02-28 14:50:12 as

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plasma	54
etching	48
introduction	46
tungsten	45
xps	39
dispositifs-experimentaux	26
high-k	22
hfo2	19
rie	16
cl2	15
tungsten-nitride	15
icp	15
cl2-o2	14
poly-si	13
actinometry	11
microelectronics	11
gate	10
dielectric	9
silicon	9
metal	9
mass-spectrometry	9
cf4	9
fluorocarbon	8
parois	8
metal-gate	8
tin	7
passivation	7
molybdenum	7
absorption	7
cf4-o2	7
fluorine	7
polydepletion	6
sf6	6
reactor	6
plasmas	6
cmos	5
titane_nitride	5
notching	5
resist-trimming	5
tan	5
sf6-n2	5
wsi	5
hbr	5
sf6-ar	5
cleaning	5
sf6-o2	5
annexes	4
sio2	4
hbr-cl2-o2	4
bcl3	4
oxidation	4
nf3	4
ecr	4
wet-etching	4
effet-de-charge	3
volatility	3
ar	3
zro2	3
recess	3
chemical-vapor-deposition	3
decomposition	3
dual-metal-gate	3
dissociation	3
tungsten-oxide	3
work-function	3
tem	3
resistivity	3
temperature	3
tunneling	3
optical-emission-spectroscopy	3
nitrogen	3
nf3-o2	2
hfalo	2
ruthenium	2
titanium	2
deposition	2
doping	2
o2	2
wcl	2
wocl	2
wsix	2
xrr	2
materials	2
chf3	2
polymer_layer	2
c4f8	2
arxps	2
meb	2
microloading	2
hbr-o2	2
bcl3-o2	2
sicl4-cl2	2
cf4-cl2	2
incorporation	2
helicon-plasma	2
cl2-nf3-o2	2
n2	1
thomas	1
hf	1
cf3-cl	1
gravure	1
photoresist	1
nf3-he	1
morel	1
sputter-deposition	1
negative-ion	1
taper	1
c4f8-ar-h2	1
45nm	1
cbrf3	1
dry-etching	1
line-edge-roughness	1
midgap	1
eels	1
tungstene	1
nf3-h2	1
vlsi	1
wcl4	1
hfsio	1
hfn	1
hfsion	1
interconnections	1
oxygen	1
microelectronique	1
3d-integration	1
magnetoplasma	1
silicidation	1
zralo	1
overetch	1
co2	1
bowing	1
gate-patterning	1
pulverisation	1
wco6	1
etchback	1
neural-networks	1
mosi	1
chf3-cl2-bcl3	1
sf6-ar-cl2	1
dhf	1
time-delay-effect	1
angle	1
hfon	1
eot	1
floating_sample	1
co	1
tac	1
new-devices	1
microtrenching	1
aluminium	1
ccl4-o2	1
moores-law	1
wiggling	1
molecular-beam-system	1
damage	1
clo	1
masking-materials	1
nh3	1
eftem	1
selectivity	1
lpcvd	1
uhf-ecr	1
tcp_9400	1
sf6-chf3	1
deformation-resist	1
tcp	1
lam	1
capacitive	1
interferometry	1

these_morel's Oehrlein:GS [6 articles] Export

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