these_morel's cl2 [15 articles] Export

Recent papers added to these_morel's library classified by the tag cl2. You can also see everyone's cl2.

	Influence of the reactor wall composition on radicals' densities and total pressure in Cl[sub 2] inductively coupled plasmas: II. During silicon etching [My Copy] Journal of Applied Physics, Vol. 102, No. 9. (2007) by G. Cunge, N. Sadeghi, R. Ramos posted to absorption cl2 dissociation etching parois plasma silicon xps by these_morel on 2008-03-05 09:18:49 as
	Influence of the reactor wall composition on radicals' densities and total pressure in Cl[sub 2] inductively coupled plasmas: I. Without silicon etching [My Copy] Journal of Applied Physics, Vol. 102, No. 9. (2007) by G. Cunge, N. Sadeghi, R. Ramos posted to absorption cl2 icp plasma xps by these_morel on 2008-03-05 09:16:38 as
	Influence of reactor walls on plasma chemistry and on silicon etch product densities during silicon etching processes in halogen-based plasmas [My Copy] Plasma Sources Science and Technology, Vol. 13, No. 3. (2004), pp. 522-530. by G. Cunge, M. Kogelschatz, N. Sadeghi posted to absorption cl2 cl2-o2 dissociation etching parois plasma silicon by these_morel on 2008-03-05 09:13:22 as
	Reactive Ion Etching of Tungsten with Chlorinated Fluorocarbons [My Copy] Journal of Electrochemical Society, Vol. 136, No. 10. (October 1989), pp. 2973-2979. by T. H. Daubenspeck, E. J. White, P. C. Sukanek posted to actinometry cl2 etching fluorocarbon rie tungsten by these_morel on 2008-03-05 08:48:01 as
	The Kinetics of Tungsten Etching by Atomic and Molecular Chlorine [My Copy] Journal of Electrochemical Society, Vol. 135, No. 8. (August 1988), pp. 2090-2095. by M. Balooch, D. S. Fischl, D. R. Olander posted to cl2 etching plasma tungsten by these_morel on 2008-03-05 08:44:22 as
	Etching of Tungsten and Tungsten Silicide Films by Chlorine Atoms [My Copy] Journal of Electrochemical Society, Vol. 135, No. 8. (August 1988), pp. 2016-2019. by D. A. Fischl, G. W. Rodrigues, D. W. Hess posted to cl2 plasma tungsten wsi by these_morel on 2008-03-05 08:39:23 as
	Estimating and controlling atomic chlorine concentration via actinometry [My Copy] Semiconductor Manufacturing, IEEE Transactions on, Vol. 12, No. 3. (1999), pp. 323-331. by C. K. Hanish, J. W. Grizzle, F. L. Teny posted to actinometry cl2 by these_morel on 2006-12-14 14:05:16 as
	The etching behavior of tungsten (W) with respect to the orientation of the grain boundary and masking layers [My Copy] Thin Solid Films, Vol. 320, No. 1. (4 May 1998), pp. 147-150. by H. C. Lee, S. Vanhaelemeersch posted to cl2 etching masking-materials sf6-ar tungsten by these_morel on 2006-06-19 09:39:31 as along with 1 person Stanley_vrc
	Selective Dry Etching of HfO2 in CF4 and Cl2/HBr-Based Chemistries. [My Copy] Japanese Journal of Applied Physics, Vol. 43, No. 4B. (April 2004), pp. 1864-1868. by Takeshi Maeda, Hiroyuki Ito, Riichiro Mitsuhashi, et al.Atsushi Horiuchi, Takaaki Kawahara, Akiyoshi Muto, Takaoki Sasaki, Kazuyoshi Torii, Hiroshi Kitajima posted to cf4 cl2 damage dhf dry-etching gate-patterning hbr hfo2 high-k wet-etching by these_morel on 2006-03-21 07:54:24 as along with 1 person molli0rm
	Role of oxygen in ion-enhanced etching of poly-Si and WSi[sub x] with chlorine [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 16, No. 4. (1998), pp. 2215-2221. by Gowri P. Kota, J. W. Coburn, David B. Graves posted to cl2 etching molecular-beam-system poly-si wsi by these_morel on 2006-02-28 15:06:32 as
	Plasma etching of HfO[sub 2] at elevated temperatures in chlorine-based chemistry [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 24, No. 1. (2006), pp. 30-40. by M. Helot, T. Chevolleau, L. Vallier, et al.O. Joubert, E. Blanquet, A. Pisch, P. Mangiagalli, T. Lill posted to cl2 dielectric etching hfo2 high-k by these_morel on 2006-02-21 09:56:36 as
	Etching of high-k dielectric Zr[sub 1 - x]Al[sub x]O[sub y] films in chlorine-containing plasmas [My Copy] The 47th international symposium: Vacuum, thin films, surfaces/interfaces, and processing NAN06, Vol. 19, No. 4. (2001), pp. 1361-1366. by K. Pelhos, V. M. Donnelly, A. Kornblit, et al.M. L. Green, R. B. Van Dover, L. Manchanda, Y. Hu, M. Morris, E. Bower posted to bcl3 cl2 dielectric high-k zralo by these_morel on 2006-02-21 09:50:49 as
	Ion-enhanced chemical etching of ZrO[sub 2] in a chlorine discharge [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 20, No. 5. (2002), pp. 1525-1531. by Lin Sha, Byeong O. Cho, Jane P. Chang posted to cl2 high-k zro2 by these_morel on 2006-02-21 09:47:00 as
	Plasma etching of high dielectric constant materials on silicon in halogen chemistries [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 22, No. 1. (2004), pp. 88-95. by Lin Sha, Jane P. Chang posted to bcl3 cl2 hfo2 high-k zro2 by these_morel on 2006-02-21 09:44:45 as
	Plasma etching selectivity of ZrO[sub 2] to Si in BCl[sub 3]/Cl[sub 2] plasmas [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 21, No. 6. (2003), pp. 1915-1922. by Lin Sha, Jane P. Chang posted to bcl3 cl2 etching high-k zro2 by these_morel on 2006-02-21 09:40:20 as along with 2 people blswenson newmansc

Note: You may cite this page as: http://www.citeulike.org/user/these_morel/tag/cl2

plasma	54
etching	48
introduction	46
tungsten	45
xps	39
dispositifs-experimentaux	26
high-k	22
hfo2	19
rie	16
cl2	15
icp	15
tungsten-nitride	15
cl2-o2	14
poly-si	13
actinometry	11
microelectronics	11
gate	10
cf4	9
dielectric	9
mass-spectrometry	9
metal	9
silicon	9
fluorocarbon	8
metal-gate	8
parois	8
absorption	7
cf4-o2	7
fluorine	7
molybdenum	7
passivation	7
tin	7
plasmas	6
polydepletion	6
reactor	6
sf6	6
cleaning	5
cmos	5
hbr	5
notching	5
resist-trimming	5
sf6-ar	5
sf6-n2	5
sf6-o2	5
tan	5
titane_nitride	5
wsi	5
annexes	4
bcl3	4
ecr	4
hbr-cl2-o2	4
nf3	4
oxidation	4
sio2	4
wet-etching	4
ar	3
chemical-vapor-deposition	3
decomposition	3
dissociation	3
dual-metal-gate	3
effet-de-charge	3
nitrogen	3
optical-emission-spectroscopy	3
recess	3
resistivity	3
tem	3
temperature	3
tungsten-oxide	3
tunneling	3
volatility	3
work-function	3
zro2	3
arxps	2
bcl3-o2	2
c4f8	2
cf4-cl2	2
chf3	2
cl2-nf3-o2	2
deposition	2
doping	2
hbr-o2	2
helicon-plasma	2
hfalo	2
incorporation	2
materials	2
meb	2
microloading	2
nf3-o2	2
o2	2
polymer_layer	2
ruthenium	2
sicl4-cl2	2
titanium	2
wcl	2
wocl	2
wsix	2
xrr	2
3d-integration	1
45nm	1
aluminium	1
angle	1
bowing	1
c4f8-ar-h2	1
capacitive	1
cbrf3	1
ccl4-o2	1
cf3-cl	1
chf3-cl2-bcl3	1
clo	1
co	1
co2	1
damage	1
deformation-resist	1
dhf	1
dry-etching	1
eels	1
eftem	1
eot	1
etchback	1
floating_sample	1
gate-patterning	1
gravure	1
hf	1
hfn	1
hfon	1
hfsio	1
hfsion	1
interconnections	1
interferometry	1
lam	1
line-edge-roughness	1
lpcvd	1
magnetoplasma	1
masking-materials	1
microelectronique	1
microtrenching	1
midgap	1
molecular-beam-system	1
moores-law	1
morel	1
mosi	1
n2	1
negative-ion	1
neural-networks	1
new-devices	1
nf3-h2	1
nf3-he	1
nh3	1
overetch	1
oxygen	1
photoresist	1
pulverisation	1
selectivity	1
sf6-ar-cl2	1
sf6-chf3	1
silicidation	1
sputter-deposition	1
tac	1
taper	1
tcp	1
tcp_9400	1
thomas	1
time-delay-effect	1
tungstene	1
uhf-ecr	1
vlsi	1
wcl4	1
wco6	1
wiggling	1
zralo	1

these_morel's cl2 [15 articles] Export

these_morel's tags