these_morel's fluorocarbon [8 articles] Export

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	Silicon etching mechanisms in a CF[sub 4]/H[sub 2] glow discharge [My Copy] Journal of Applied Physics, Vol. 62, No. 2. (1987), pp. 662-672. by Gottlieb S. Oehrlein, Holly L. Williams posted to cf4 etching fluorocarbon silicon by these_morel on 2008-09-04 13:20:25 as
	Role of fluorocarbon film formation in the etching of silicon, silicon dioxide, silicon nitride, and amorphous hydrogenated silicon carbide [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 22, No. 1. (2004), pp. 53-60. by T. E. F. M. Standaert, C. Hedlund, E. A. Joseph, G. S. Oehrlein, T. J. Dalton posted to fluorocarbon introduction plasma by these_morel on 2008-07-08 06:56:38 as
	Fluorocarbon polymer deposition kinetics in a low-pressure, high-density, inductively coupled plasma reactor [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 18, No. 5. (2000), pp. 2122-2129. by M. J. Sowa, M. E. Littau, V. Pohray, J. L. Cecchi posted to fluorocarbon introduction plasma by these_morel on 2008-07-08 06:55:38 as
	The role of polymer deposited in differential dielectric etch [My Copy] The 42nd national symposium of the American Vacuum Society, Vol. 14, No. 3. (1996), pp. 1092-1095. by S. Fang, C. Chiang, D. Fraser, et al.B. Lee, P. Keswick, M. Chang, K. Fung posted to fluorocarbon introduction plasma by these_morel on 2008-07-08 06:54:36 as
	Reactive Ion Etching of Tungsten with Chlorinated Fluorocarbons [My Copy] Journal of Electrochemical Society, Vol. 136, No. 10. (October 1989), pp. 2973-2979. by T. H. Daubenspeck, E. J. White, P. C. Sukanek posted to actinometry cl2 etching fluorocarbon rie tungsten by these_morel on 2008-03-05 08:48:01 as
	Etching characteristics of high-k dielectric HfO[sub 2] thin films in inductively coupled fluorocarbon plasmas [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 23, No. 6. (2005), pp. 1691-1697. by Kazuo Takahashi, Kouichi Ono, Yuichi Setsuhara posted to etching fluorocarbon hfo2 plasma xps by these_morel on 2006-12-13 15:40:29 as
	Selective etching of high-k HfO[sub 2] films over Si in hydrogen-added fluorocarbon (CF[sub 4]/Ar/H[sub 2] and C[sub 4]F[sub 8]/Ar/H[sub 2]) plasmas [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 24, No. 3. (2006), pp. 437-443. by Kazuo Takahashi, Kouichi Ono posted to etching fluorocarbon hfo2 plasmas xps by these_morel on 2006-12-13 15:38:19 as
	Etching of SiO[sub 2] and Si in fluorocarbon plasmas: A detailed surface model accounting for etching and deposition [My Copy] Journal of Applied Physics, Vol. 88, No. 10. (2000), pp. 5570-5584. by Evangelos Gogolides, Philippe Vauvert, George Kokkoris, Guy Turban, Andreas G. Boudouvis posted to fluorocarbon sio2 by these_morel on 2006-05-10 08:20:28 as

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plasma	54
etching	48
introduction	46
tungsten	45
xps	39
dispositifs-experimentaux	26
high-k	22
hfo2	19
rie	16
cl2	15
icp	15
tungsten-nitride	15
cl2-o2	14
poly-si	13
actinometry	11
microelectronics	11
gate	10
cf4	9
dielectric	9
mass-spectrometry	9
metal	9
silicon	9
fluorocarbon	8
metal-gate	8
parois	8
absorption	7
cf4-o2	7
fluorine	7
molybdenum	7
passivation	7
tin	7
plasmas	6
polydepletion	6
reactor	6
sf6	6
cleaning	5
cmos	5
hbr	5
notching	5
resist-trimming	5
sf6-ar	5
sf6-n2	5
sf6-o2	5
tan	5
titane_nitride	5
wsi	5
annexes	4
bcl3	4
ecr	4
hbr-cl2-o2	4
nf3	4
oxidation	4
sio2	4
wet-etching	4
ar	3
chemical-vapor-deposition	3
decomposition	3
dissociation	3
dual-metal-gate	3
effet-de-charge	3
nitrogen	3
optical-emission-spectroscopy	3
recess	3
resistivity	3
tem	3
temperature	3
tungsten-oxide	3
tunneling	3
volatility	3
work-function	3
zro2	3
arxps	2
bcl3-o2	2
c4f8	2
cf4-cl2	2
chf3	2
cl2-nf3-o2	2
deposition	2
doping	2
hbr-o2	2
helicon-plasma	2
hfalo	2
incorporation	2
materials	2
meb	2
microloading	2
nf3-o2	2
o2	2
polymer_layer	2
ruthenium	2
sicl4-cl2	2
titanium	2
wcl	2
wocl	2
wsix	2
xrr	2
3d-integration	1
45nm	1
aluminium	1
angle	1
bowing	1
c4f8-ar-h2	1
capacitive	1
cbrf3	1
ccl4-o2	1
cf3-cl	1
chf3-cl2-bcl3	1
clo	1
co	1
co2	1
damage	1
deformation-resist	1
dhf	1
dry-etching	1
eels	1
eftem	1
eot	1
etchback	1
floating_sample	1
gate-patterning	1
gravure	1
hf	1
hfn	1
hfon	1
hfsio	1
hfsion	1
interconnections	1
interferometry	1
lam	1
line-edge-roughness	1
lpcvd	1
magnetoplasma	1
masking-materials	1
microelectronique	1
microtrenching	1
midgap	1
molecular-beam-system	1
moores-law	1
morel	1
mosi	1
n2	1
negative-ion	1
neural-networks	1
new-devices	1
nf3-h2	1
nf3-he	1
nh3	1
overetch	1
oxygen	1
photoresist	1
pulverisation	1
selectivity	1
sf6-ar-cl2	1
sf6-chf3	1
silicidation	1
sputter-deposition	1
tac	1
taper	1
tcp	1
tcp_9400	1
thomas	1
time-delay-effect	1
tungstene	1
uhf-ecr	1
vlsi	1
wcl4	1
wco6	1
wiggling	1
zralo	1

these_morel's fluorocarbon [8 articles] Export

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