these_morel's metal [9 articles] Export

Recent papers added to these_morel's library classified by the tag metal. You can also see everyone's metal.

	Plasma etching: principles, mechanisms, application to micro- and nano-technologies [My Copy] Applied Surface Science, Vol. 164, No. 1-4. (1 September 2000), pp. 72-83. by Christophe Cardinaud, Marie-Claude Peignon, Pierre-Yves Tessier posted to introduction metal volatility by these_morel on 2008-07-18 12:38:24 as
	The work function of the elements and its periodicity [My Copy] Journal of Applied Physics, Vol. 48, No. 11. (1977), pp. 4729-4733. by Herbert B. Michaelson posted to gate introduction metal work-function by these_morel on 2008-05-20 13:59:25 as
	CMOS scaling into the nanometer regime [My Copy] Proceedings of the IEEE In Proceedings of the IEEE, Vol. 85, No. 4. (06 August 2002), pp. 486-504. by Yuan Taur, D. A. Buchanan, Wei Chen, et al.D. J. Frank, K. E. Ismail, Shih-Hsien Lo, G. A. Sai-Halasz, R. G. Viswanathan, H. J. C. Wann, S. J. Wind, Hon-Sum Wong posted to capacitive gate introduction metal by these_morel on 2008-05-20 10:04:37 as along with 2 people phlip philip-eecs
	Reliable tantalum-gate fully-depleted-SOI MOSFET technology featuring low-temperature processing [My Copy] IEEE Transactions on Electron Devices In Electron Devices, IEEE Transactions on, Vol. 44, No. 9. (1997), pp. 1467-1472. by T. Ushiki, Mo-Chiun Yu, Y. Hirano, H. Shimada, M. Morita, T. Ohmi posted to gate introduction metal metal-gate resistivity by these_morel on 2008-05-20 10:02:41 as
	WSix/WN/polysilicon DRAM gate stack with a 50 A WN layer as a diffusion barrier and an etch stop [My Copy] Materials Science in Semiconductor Processing, Vol. 8, No. 5. (October 2005), pp. 602-607. by Heon Lee, Dong-Hwan Kim, Joo-Youl Huh, Deok-Kee Kim posted to cl2-nf3-o2 gate metal poly-si tcp tungsten-nitride wsi by these_morel on 2006-02-17 15:45:45 as
	Integration of Dual Metal Gate CMOS on High-k Dielectrics Utilizing a Metal Wet Etch Process [My Copy] Electrochemical and Solid-State Letters, Vol. 8, No. 10. (2005), pp. G271-G274. by Zhibo Zhang, S. C. Song, Craig Huffman, et al.Muhammad M. Hussain, Joel Barnett, Naim Moumen, Husam N. Alshareef, Prashant Majhi, Johnny H. Sim, Sang H. Bae, Byoung H. Lee posted to dielectric gate high-k metal wet-etching by these_morel on 2006-02-17 15:40:27 as
	Plasma etching of high-k and metal gate materials [My Copy] Vacuum, Vol. In Press, Corrected Proof by Keisuke Nakamura, Tomohiro Kitagawa, Kazushi Osari, Kazuo Takahashi, Kouichi Ono posted to ecr hfo2 high-k metal by these_morel on 2006-02-17 15:39:06 as
	Effects of Nitrogen Additive Gas on Sidewall Passivation in W/TiN/High-k Dielectric Gate Etching [My Copy] Microprocesses and Nanotechnology Conference, 2000 International (2000), pp. 210-211. by Jae-Young Kim, Yu-Kwon Kim, Kwang-Ok Kim, Chang J. Choi, Jin W. Kim posted to dielectric etching gate high-k metal tin tungsten by these_morel on 2006-02-17 13:47:00 as
	Metal gate technology for nanoscale transistors--material selection and process integration issues [My Copy] Thin Solid Films, Vol. 462-463 (September 2004), pp. 34-41. by Yee-Chia Yeo posted to dielectric gate high-k materials metal work-function by these_morel on 2006-02-07 11:15:53 as

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plasma	54
etching	48
introduction	46
tungsten	45
xps	39
dispositifs-experimentaux	26
high-k	22
hfo2	19
rie	16
cl2	15
icp	15
tungsten-nitride	15
cl2-o2	14
poly-si	13
actinometry	11
microelectronics	11
gate	10
cf4	9
dielectric	9
mass-spectrometry	9
metal	9
silicon	9
fluorocarbon	8
metal-gate	8
parois	8
absorption	7
cf4-o2	7
fluorine	7
molybdenum	7
passivation	7
tin	7
plasmas	6
polydepletion	6
reactor	6
sf6	6
cleaning	5
cmos	5
hbr	5
notching	5
resist-trimming	5
sf6-ar	5
sf6-n2	5
sf6-o2	5
tan	5
titane_nitride	5
wsi	5
annexes	4
bcl3	4
ecr	4
hbr-cl2-o2	4
nf3	4
oxidation	4
sio2	4
wet-etching	4
ar	3
chemical-vapor-deposition	3
decomposition	3
dissociation	3
dual-metal-gate	3
effet-de-charge	3
nitrogen	3
optical-emission-spectroscopy	3
recess	3
resistivity	3
tem	3
temperature	3
tungsten-oxide	3
tunneling	3
volatility	3
work-function	3
zro2	3
arxps	2
bcl3-o2	2
c4f8	2
cf4-cl2	2
chf3	2
cl2-nf3-o2	2
deposition	2
doping	2
hbr-o2	2
helicon-plasma	2
hfalo	2
incorporation	2
materials	2
meb	2
microloading	2
nf3-o2	2
o2	2
polymer_layer	2
ruthenium	2
sicl4-cl2	2
titanium	2
wcl	2
wocl	2
wsix	2
xrr	2
3d-integration	1
45nm	1
aluminium	1
angle	1
bowing	1
c4f8-ar-h2	1
capacitive	1
cbrf3	1
ccl4-o2	1
cf3-cl	1
chf3-cl2-bcl3	1
clo	1
co	1
co2	1
damage	1
deformation-resist	1
dhf	1
dry-etching	1
eels	1
eftem	1
eot	1
etchback	1
floating_sample	1
gate-patterning	1
gravure	1
hf	1
hfn	1
hfon	1
hfsio	1
hfsion	1
interconnections	1
interferometry	1
lam	1
line-edge-roughness	1
lpcvd	1
magnetoplasma	1
masking-materials	1
microelectronique	1
microtrenching	1
midgap	1
molecular-beam-system	1
moores-law	1
morel	1
mosi	1
n2	1
negative-ion	1
neural-networks	1
new-devices	1
nf3-h2	1
nf3-he	1
nh3	1
overetch	1
oxygen	1
photoresist	1
pulverisation	1
selectivity	1
sf6-ar-cl2	1
sf6-chf3	1
silicidation	1
sputter-deposition	1
tac	1
taper	1
tcp	1
tcp_9400	1
thomas	1
time-delay-effect	1
tungstene	1
uhf-ecr	1
vlsi	1
wcl4	1
wco6	1
wiggling	1
zralo	1

these_morel's metal [9 articles] Export

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