these_morel's xps [39 articles] Export

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	Développement de procédés de gravure de grille métallique W, WN pour les nœuds technologiques sub-45 nm [My Copy] (May 2009) by Thomas Morel posted to 45nm gravure microelectronique morel plasma thomas tungstene xps by these_morel on 2009-07-01 07:47:39 as
	Tungsten metal gate etching in Cl[sub 2]/O[sub 2] inductively coupled high density plasmas [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 26, No. 6. (2008), pp. 1875-1882. by T. Morel, S. Bamola, R. Ramos, A. Beaurain, E. Pargon, O. Joubert posted to cl2-nf3-o2 cl2-o2 metal-gate tungsten xps by these_morel on 2009-06-02 15:05:04 as
	Polysilicon gate etching in high density plasmas. II. X-ray photoelectron spectroscopy investigation of silicon trenches etched using a chlorine-based chemistry [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 14, No. 3. (1996), pp. 1796-1806. by F. H. Bell, O. Joubert, L. Vallier posted to xps by these_morel on 2008-12-15 14:25:33 as
	Hartree-Slater subshell photoionization cross-sections at 1254 and 1487 eV [My Copy] Journal of Electron Spectroscopy and Related Phenomena, Vol. 8, No. 2. (1976), pp. 129-137. by J. H. Scofield posted to xps by these_morel on 2008-12-15 14:23:27 as along with 1 person slavo006
	Analyse de surface par ESCA - Principes et instrumentations [My Copy] Techniques de l'ingénieur, Vol. P2625 (1988) by Tran M. Duc posted to xps by these_morel on 2008-12-15 14:15:05 as
	Isolation and characterization of reactive intermediates and active catalysts in homogeneous catalysis [My Copy] Journal of the American Chemical Society, Vol. 107, No. 8. (1 April 1985), pp. 2380-2388. by Paul G. Gassman, David W. Macomber, Stephen M. Willging posted to tungsten wcl4 xps by these_morel on 2008-12-09 09:35:35 as
	Plasma reactor dry cleaning strategy after TiN, TaN and HfO[sub 2] etching processes [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 26, No. 1. (2008), pp. 181-188. by R. Ramos, G. Cunge, O. Joubert posted to cleaning parois xps by these_morel on 2008-10-21 09:41:08 as
	Parallel angle resolved XPS investigations on 12 in. wafers for the study of W and WSix oxidation in air [My Copy] Microelectronic Engineering, Vol. 85, No. 9. (September 2008), pp. 1882-1887. by B. Pelissier, A. Beaurain, J. P. Barnes, R. Gassilloud, F. Martin, O. Joubert posted to arxps oxidation tungsten xps by these_morel on 2008-09-19 08:41:13 as
	RBS-ERDA, XPS and XRD characterizations of PECVD tungsten nitride films [My Copy] Applied Surface Science, Vol. 125, No. 3-4. (March 1998), pp. 313-320. by C. Meunier, C. Monteil, C. Savall, et al.F. Palmino, J. Weber, R. Berjoan, J. Durand posted to tungsten-nitride xps by these_morel on 2008-08-29 15:49:33 as
	Effect of NH[sub 3] on Film Properties of MOCVD Tungsten Nitride from Cl[sub 4](CH[sub 3]CN)W(N[sup i]Pr) [My Copy] Journal of The Electrochemical Society, Vol. 151, No. 10. (2004), pp. G697-G703. by Omar J. Bchir, Kee C. Kim, Timothy J. Anderson, Valentin Craciun, Benjamin C. Brooks, Lisa M. White posted to nh3 tungsten-nitride xps by these_morel on 2008-08-27 16:04:19 as
	Quantitative analysis of angle-resolved XPS spectra recorded in parallel data acquisition mode [My Copy] Surface and Interface Analysis, Vol. 36, No. 13. (2004), pp. 1629-1636. by M. S. Vinodh, L. P. H. Jeurgens posted to arxps dispositifs-experimentaux xps by these_morel on 2008-08-12 07:02:25 as
	Analyse de surface par ESCA - Analyse élémentaire et applications [My Copy] Techniques de l'ingénieur, Vol. P2626 (September 1998) by Tran M. Duc posted to dispositifs-experimentaux xps by these_morel on 2008-07-21 15:17:11 as
	Spectroscopies de photoélectrons: XPS ou ESCA et UPS [My Copy] Techniques de l'ingénieur, Vol. P2625 (April 1986) by Guy Hollinger posted to dispositifs-experimentaux xps by these_morel on 2008-07-21 15:14:45 as
	Handbook of X Ray Photoelectron Spectroscopy (P/N 624755) [My Copy] (1992) by John F. Moulder, William F. Stickle, Peter E. Sobol posted to dispositifs-experimentaux xps by these_morel on 2008-07-21 15:06:24 as
	Practical Surface Analysis: Auger and X-Ray Photoelectron Spectroscopy [My Copy] (23 August 1983) by D. Briggs, M. P. Seah posted to dispositifs-experimentaux xps by these_morel on 2008-07-21 15:01:32 as
	Influence of the reactor wall composition on radicals' densities and total pressure in Cl[sub 2] inductively coupled plasmas: II. During silicon etching [My Copy] Journal of Applied Physics, Vol. 102, No. 9. (2007) by G. Cunge, N. Sadeghi, R. Ramos posted to absorption cl2 dissociation etching parois plasma silicon xps by these_morel on 2008-03-05 09:18:49 as
	Influence of the reactor wall composition on radicals' densities and total pressure in Cl[sub 2] inductively coupled plasmas: I. Without silicon etching [My Copy] Journal of Applied Physics, Vol. 102, No. 9. (2007) by G. Cunge, N. Sadeghi, R. Ramos posted to absorption cl2 icp plasma xps by these_morel on 2008-03-05 09:16:38 as
	Poly-Si/TiN/HfO[sub 2] gate stack etching in high-density plasmas [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 25, No. 3. (2007), pp. 767-778. by A. Le Gouil, O. Joubert, G. Cunge, et al.T. Chevolleau, L. Vallier, B. Chenevier, I. Matko posted to effet-de-charge etching poly-si tin xps by these_morel on 2008-03-05 09:03:24 as
	Sub-0.1 mu m gate etch processes: Towards some limitations of the plasma technology? [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 18, No. 1. (2000), pp. 156-165. by L. Desvoivres, L. Vallier, O. Joubert posted to oxidation recess silicon xps by these_morel on 2008-03-05 08:58:33 as
	Monitoring chamber walls coating deposited during plasma processes: Application to silicon gate etch processes [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 22, No. 3. (2004), pp. 553-563. by O. Joubert, G. Cunge, B. Pelissier, L. Vallier, M. Kogelschatz, E. Pargon posted to floating_sample plasma xps by these_morel on 2007-10-08 14:47:12 as
	Influence of Carbon-Chlorine Surface Complexes on the Properties of Tungsten Oxide Supported on Activated Carbons. 1. Dispersion, Distribution, and Chemical Nature of the Metal Oxide Phase [My Copy] J. Phys. Chem. B, Vol. 107, No. 21. (29 May 2003), pp. 4997-5002. by A. F. Perez-Cadenas, F. J. Maldonado-Hodar, J. L. G. Fierro, C. Moreno-Castilla posted to tungsten tungsten-oxide xps by these_morel on 2007-09-28 07:24:02 as
	Chemical downstream etching of tungsten [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 16, No. 4. (1998), pp. 2115-2119. by M. G. Blain, R. L. Jarecki, R. J. Simonson posted to tungsten tungsten-oxide xps by these_morel on 2007-09-28 07:20:17 as
	Etching of tungsten with XeF[sub 2]: An x-ray photoelectron spectroscopy study [My Copy] Journal of Applied Physics, Vol. 62, No. 11. (1987), pp. 4587-4590. by A. Bensaoula, E. Grossman, A. Ignatiev posted to fluorine tungsten xps by these_morel on 2007-08-03 10:53:57 as
	New chamber walls conditioning and cleaning strategies to improve the stability of plasma processes [My Copy] Plasma Sources Science and Technology, Vol. 14 (2005), pp. 599-609. by G. Cunge, B. Pelissier, O. Joubert, R. Ramos, C. Maurice posted to parois xps by these_morel on 2007-08-03 10:36:20 as
	X-ray photoelectron spectroscopy characteristics of the W/TiN/Si and W/TiN/SiO2/Si structures [My Copy] Journal of Electron Spectroscopy and Related Phenomena, Vol. 63, No. 2. (2 August 1993), pp. 145-153. by Sunil Kumar, D. R. Chopra, Gregory C. Smith posted to titane_nitride tungsten xps by these_morel on 2007-04-04 12:55:19 as
	Thermal decomposition mechanisms of tungsten nitride CVD precursors on Cu(1 1 1) [My Copy] Surface Science, Vol. 600, No. 3. (1 February 2006), pp. 743-754. by Yaw-Wen Yang, Jin-Bao Wu, Jelin Wang, Yi-Feng Lin, Hsin-Tien Chiu posted to chemical-vapor-deposition tungsten-nitride xps by these_morel on 2007-03-30 15:56:19 as
	Etching characteristics of TiN used as hard mask in dielectric etch process [My Copy] Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 24, No. 5. (2006), pp. 2262-2270. by M. Darnon, T. Chevolleau, D. Eon, L. Vallier, J. Torres, O. Joubert posted to titane_nitride xps by these_morel on 2007-02-28 07:59:19 as
	The effect of nitrogen ion implantation on tungsten surfaces [My Copy] Applied Surface Science, Vol. 150, No. 1-4. (11 August 1999), pp. 34-38. by H. L. Zhang, D. Z. Wang, N. K. Huang posted to tungsten-nitride xps by these_morel on 2006-12-13 15:58:04 as
	Tungsten nitride films grown via pulsed laser deposition studied in situ by electron spectroscopies [My Copy] Applied Surface Science, Vol. 214, No. 1-4. (31 May 2003), pp. 58-67. by G. Soto, W. Delacruz, F. F. Castillon, J. A. Diaz, R. Machorro, M. H. Farias posted to tungsten-nitride xps by these_morel on 2006-12-13 15:55:32 as
	XPS, XES and XAS studies of the electronic structure of tungsten oxides [My Copy] Journal of Alloys and Compounds, Vol. 305, No. 1-2. (6 June 2000), pp. 1-6. by Khyzhun posted to tungsten-oxide xps by these_morel on 2006-12-13 15:52:09 as
	$My PDF fracassi_95_dry.pdf$ Dry etching of titanium nitride thin films in CF[sub 4]--O[sub 2] plasmas [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 13, No. 2. (1995), pp. 335-342. by F. Fracassi, R. D'agostino, R. Lamendola, I. Mangieri posted to cf4-o2 etching titane_nitride xps by these_morel on 2006-12-13 15:42:58 as
	Etching characteristics of high-k dielectric HfO[sub 2] thin films in inductively coupled fluorocarbon plasmas [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 23, No. 6. (2005), pp. 1691-1697. by Kazuo Takahashi, Kouichi Ono, Yuichi Setsuhara posted to etching fluorocarbon hfo2 plasma xps by these_morel on 2006-12-13 15:40:29 as
	Selective etching of high-k HfO[sub 2] films over Si in hydrogen-added fluorocarbon (CF[sub 4]/Ar/H[sub 2] and C[sub 4]F[sub 8]/Ar/H[sub 2]) plasmas [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 24, No. 3. (2006), pp. 437-443. by Kazuo Takahashi, Kouichi Ono posted to etching fluorocarbon hfo2 plasmas xps by these_morel on 2006-12-13 15:38:19 as
	Reactive sputter deposition of tungsten nitride thin films [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 20, No. 5. (2002), pp. 1699-1703. by Colin C. Baker, Ismat S. Shah posted to resistivity sputter-deposition tungsten-nitride xps by these_morel on 2006-12-13 15:35:21 as
	Reactive Ion Etching of Tungsten in SF[sub 6]-N[sub 2] Plasma [My Copy] Journal of Electrochemical Society, Vol. 137, No. 1. (January 1990), pp. 225-229. by Nobuki Mutsukura, Guy Turban posted to sf6-n2 tungsten xps by these_morel on 2006-12-13 15:27:43 as
	Dry Etching of TaN/HfO2 Gate Stack Structure by Cl2/SF6/Ar Inductively Coupled Plasma. [My Copy] Japanese Journal of Applied Physics, Vol. 44, No. 7B. (2005), pp. 5811-5818. by Myoung H. Shin, Sung W. Na, Nae E. Lee, et al.Tae K. Oh, Jiyoung Kim, Taeho Lee, Jinho Ahn posted to hfo2 sf6-ar-cl2 tan xps by these_morel on 2006-08-04 08:47:29 as
	Ultra thin tungsten nitride film growth on dielectric surfaces [My Copy] Thin Solid Films, Vol. 458, No. 1-2. (30 June 2004), pp. 251-256. by Sun, E. R. Engbrecht, T. Bolom, et al.C. Cilino, J. H. Sim, J. M. White, J. G. Ekerdt, K. Pfeifer posted to chemical-vapor-deposition tungsten-nitride wco6 xps by these_morel on 2006-06-19 10:07:54 as
	Tungsten etching mechanisms in CF[sub 4]/O[sub 2] reactive ion etching plasmas [My Copy] Journal of Applied Physics, Vol. 66, No. 10. (1989), pp. 5034-5038. by Tim D. Bestwick, Gottlieb S. Oehrlein posted to cf4-o2 rie tungsten xps by these_morel on 2006-05-12 09:49:54 as along with 1 person Stanley_vrc
	Investigation of etching properties of HfO based high-K dielectrics using inductively coupled plasma [My Copy] Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 22, No. 4. (2004), pp. 1552-1558. by Jinghao Chen, Won J. Yoo, Zerlinda Y. L. Tan, Yingqian Wang, Daniel S. H. Chan posted to cl2-o2 fluorine hbr-o2 hfalo hfo2 hfon hfsio high-k xps by these_morel on 2006-02-17 15:12:43 as

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plasma	54
etching	48
introduction	46
tungsten	45
xps	39
dispositifs-experimentaux	26
high-k	22
hfo2	19
rie	16
cl2	15
icp	15
tungsten-nitride	15
cl2-o2	14
poly-si	13
actinometry	11
microelectronics	11
gate	10
cf4	9
dielectric	9
mass-spectrometry	9
metal	9
silicon	9
fluorocarbon	8
metal-gate	8
parois	8
absorption	7
cf4-o2	7
fluorine	7
molybdenum	7
passivation	7
tin	7
plasmas	6
polydepletion	6
reactor	6
sf6	6
cleaning	5
cmos	5
hbr	5
notching	5
resist-trimming	5
sf6-ar	5
sf6-n2	5
sf6-o2	5
tan	5
titane_nitride	5
wsi	5
annexes	4
bcl3	4
ecr	4
hbr-cl2-o2	4
nf3	4
oxidation	4
sio2	4
wet-etching	4
ar	3
chemical-vapor-deposition	3
decomposition	3
dissociation	3
dual-metal-gate	3
effet-de-charge	3
nitrogen	3
optical-emission-spectroscopy	3
recess	3
resistivity	3
tem	3
temperature	3
tungsten-oxide	3
tunneling	3
volatility	3
work-function	3
zro2	3
arxps	2
bcl3-o2	2
c4f8	2
cf4-cl2	2
chf3	2
cl2-nf3-o2	2
deposition	2
doping	2
hbr-o2	2
helicon-plasma	2
hfalo	2
incorporation	2
materials	2
meb	2
microloading	2
nf3-o2	2
o2	2
polymer_layer	2
ruthenium	2
sicl4-cl2	2
titanium	2
wcl	2
wocl	2
wsix	2
xrr	2
3d-integration	1
45nm	1
aluminium	1
angle	1
bowing	1
c4f8-ar-h2	1
capacitive	1
cbrf3	1
ccl4-o2	1
cf3-cl	1
chf3-cl2-bcl3	1
clo	1
co	1
co2	1
damage	1
deformation-resist	1
dhf	1
dry-etching	1
eels	1
eftem	1
eot	1
etchback	1
floating_sample	1
gate-patterning	1
gravure	1
hf	1
hfn	1
hfon	1
hfsio	1
hfsion	1
interconnections	1
interferometry	1
lam	1
line-edge-roughness	1
lpcvd	1
magnetoplasma	1
masking-materials	1
microelectronique	1
microtrenching	1
midgap	1
molecular-beam-system	1
moores-law	1
morel	1
mosi	1
n2	1
negative-ion	1
neural-networks	1
new-devices	1
nf3-h2	1
nf3-he	1
nh3	1
overetch	1
oxygen	1
photoresist	1
pulverisation	1
selectivity	1
sf6-ar-cl2	1
sf6-chf3	1
silicidation	1
sputter-deposition	1
tac	1
taper	1
tcp	1
tcp_9400	1
thomas	1
time-delay-effect	1
tungstene	1
uhf-ecr	1
vlsi	1
wcl4	1
wco6	1
wiggling	1
zralo	1

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