vidal31's library 136 articles Export

	Making real money in virtual worlds: MMORPGs and emerging business opportunities, challenges and ethical implications in metaverses [My Copy] Technological Forecasting and Social Change, Vol. In Press, Corrected Proof by Savvas Papagiannidis, Michael Bourlakis, Feng Li posted to currency mmorpg money virtual by vidal31 on 2008-01-23 16:27:50 as
	Fatigue and Intermetallic Formation in Lead Free Solder Die Attach [My Copy] (9-13 July 2001) by P. Mccluskey edited by Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 9-13, 2001 posted to lead-free by vidal31 on 2007-07-18 12:50:13 as
	Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder - GEIA-STD-0005-1 [My Copy] posted to lead-free by vidal31 on 2007-07-18 10:46:19 as
	Solder Paste Evaluation Techniques for Pb-Free [My Copy] posted to lead-free by vidal31 on 2007-07-13 13:11:33 as
	Lead-free Controlling Tombstoning Behavior [My Copy] posted to lead-free by vidal31 on 2007-07-13 13:09:10 as
	Eliminate Lead-free Wave Soldering [My Copy] posted to lead-free by vidal31 on 2007-07-13 13:07:07 as
	Development of a lead free chip scale package for wireless applications [My Copy] Electronic Components and Technology Conference, 2001. Proceedings., 51st (2001), pp. 665-670. by V. Kripesh, Poi-Siong Teo, C. T. Tai, G. Vishwanadam, Yew C. Mui posted to lead-free by vidal31 on 2007-07-13 12:57:27 as
	C4NP as a High-Volume Manufacturing Method for Fine-Pitch and Lead-Free FlipChip Solder Bumping [My Copy] Electronics Systemintegration Technology Conference, 2006. 1st, Vol. 1 (2006), pp. 518-524. by Eric Laine, Klaus Ruhmer, Eric Perfecto, Hai Longworth, David Hawken posted to lead-free by vidal31 on 2007-07-13 11:45:03 as
	Understanding the process window for printing lead-free solder pastes [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 24, No. 4. (2001), pp. 249-254. by T. A. Nguty, B. Salam, R. Durairaj, N. N. Ekere posted to lead-free by vidal31 on 2007-07-13 11:43:03 as
	Lead free interfacial structures and their relationship to Au plating including accelerated thermal cycle testing of non-leaden BGA spheres [My Copy] Electronic Components and Technology Conference, 2001. Proceedings., 51st (2001), pp. 675-680. by T. Taguchi, R. Kato, S. Akita, A. Okuno, H. Suzuki, T. Okuno posted to lead-free by vidal31 on 2007-07-13 11:36:31 as
	Process optimization of lead-free wafer-level underfill material used in chip scale packaging [My Copy] Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on (2005), pp. 293-297. by Y. Liu, G. Dutt, A. Xiao posted to lead-free by vidal31 on 2007-07-13 10:52:59 as
	TBGA substrate for lead-free and halogen-free applications [My Copy] Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the (2004), pp. 45-49. by C. Q. Cui, K. Pun posted to lead-free by vidal31 on 2007-07-13 10:50:34 as
	Microstructure and mechanical properties investigation of lead-free solder Sn/sub 99.3/Cu/sub 0.7/ [My Copy] Electronic Packaging Technology, 2005 6th International Conference on (2005), pp. 466-470. by Fulong Zhu, Honghai Zhang, Rongfeng Guan, Sheng Liu posted to lead-free by vidal31 on 2007-07-13 10:48:35 as
	Are you ready for lead-free electronics? [My Copy] Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on], Vol. 28, No. 4. (2005), pp. 884-894. by V. Eveloy, S. Ganesan, Y. Fukuda, Ji Wu, M. G. Pecht posted to lead-free by vidal31 on 2007-07-13 10:45:57 as
	Challenges in converting to lead-free electronics [My Copy] Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd (2000), pp. 6-9. by C. M. Garner, V. Gupta, V. Bissessur, A. Kumar, R. Aspandiar posted to lead-free by vidal31 on 2007-07-13 10:43:36 as
	Wave Soldering Using Sn/3.0Ag/0.5Cu Solder and Water Soluble VOC-Free Flux [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 29, No. 3. (2006), pp. 202-210. by G. Wable, Q. Chu, P. Damodaran, K. Srihari posted to lead-free by vidal31 on 2007-07-13 10:41:27 as
	Research on failure modes of BGA assemblies with lead-free solder on different PCB materials [My Copy] Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on (2003), pp. 396-400. by Fangjuan Qi, Jim Liu posted to lead-free by vidal31 on 2007-07-13 10:39:38 as
	Lead-free chip scale packages: assembly and drop test reliability [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 29, No. 1. (2006), pp. 1-9. by Yueli Liu, Guoyun Tian, S. Gale, R. W. Johnson, L. Crane posted to lead-free by vidal31 on 2007-07-13 10:37:08 as
	Lead-free soldering effect to tantalum capacitors [My Copy] Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on (2003), pp. 85-89. by T. Zednicek, P. Vasina, Z. Sita, B. Vrana posted to lead-free by vidal31 on 2007-07-13 10:32:26 as
	Structure and kinetics of Sn whisker growth on Pb-free solder finish [My Copy] Electronic Components and Technology Conference, 2002. Proceedings. 52nd (2002), pp. 628-633. by W. J. Choi, T. Y. Lee, K. N. Tu, et al.N. Tamura, R. S. Celestre, A. A. Macdowell, Y. Y. Bong, L. Nguyen, G. T. T. Sheng posted to lead-free whiskers by vidal31 on 2007-07-13 10:28:59 as
	Electrodeposited tin properties & their effect on component finish reliability [My Copy] Business of Electronic Product Reliability and Liability, 2004 International Conference on (2004), pp. 29-34. by R. Schetty posted to lead-free whiskers by vidal31 on 2007-07-13 10:27:09 as
	Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 36-62. by J. W. Osenbach, R. L. Shook, B. T. Vaccaro, et al.B. D. Potteiger, A. N. Amin, K. N. Hooghan, P. Suratkar, P. Ruengsinsub posted to lead-free whiskers by vidal31 on 2007-07-13 10:25:41 as
	Detection of tin plating and tin whisker mitigation [My Copy] Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International (2004), pp. 563-564. by W. D. Bjorndahl, L. Singleton, R. Griese, F. Chong posted to lead-free whiskers by vidal31 on 2007-07-13 10:24:06 as
	Pb-free plating: a process and solder joint reliability study [My Copy] Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th (2004), pp. 162-168. by Ming S. Ong, Yi M. Lau, Ah C. Tan posted to lead-free whiskers by vidal31 on 2007-07-13 10:22:01 as
	Matte tin (Sn) plating: whisker growth study [My Copy] Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th (2004), pp. 281-288. by A. Sriyarunya, J. Tondtan, D. Bansal posted to lead-free whiskers by vidal31 on 2007-07-13 10:20:37 as
	Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy [My Copy] Electronics Packaging Technology Conference, 2006. EPTC '06. 8th (2006), pp. 398-403. by H. Sosiati, N. Kuwano, S. Hata, Y. Iwane, Y. Morizono, Y. Ohno posted to lead-free whiskers by vidal31 on 2007-07-13 10:17:51 as
	Portable X-ray fluorescence analyzer for the first level screening of materials for prohibited substances [My Copy] Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 7-13. by S. Piorek posted to lead-free whiskers by vidal31 on 2007-07-13 10:16:27 as
	Lead free packaging and Sn-whiskers [My Copy] Electronic Components and Technology Conference, 2004. Proceedings. 54th, Vol. 2 (2004), pp. 1314-1324 Vol.2. by J. W. Osenbach, R. L. Shook, B. T. Vaccaro, B. D. Potteiger, A. Amin, P. Ruengsinsub posted to lead-free whiskers by vidal31 on 2007-07-13 10:14:52 as
	Carbon Nanotube Filled Conductive Adhesives for Aerospace Applications [My Copy] Aerospace Conference, 2007 IEEE (2007), pp. 1-6. by Jing Li, Janet K. Lumpp posted to lead-free whiskers by vidal31 on 2007-07-13 10:13:16 as
	The Sn Whisker Growth Evolution of IC Packaging on the PC Board Assembly [My Copy] Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th (2007), pp. 1964-1970. by Jeffrey C. Lee, P. C. Chen, C. G. Tyan posted to lead-free whiskers by vidal31 on 2007-07-13 10:11:28 as
	Behavior of whisker growth on tin plated Fe-42%Ni substrates [My Copy] Electronics Packaging Technology Conference, 2006. EPTC '06. 8th (2006), pp. 150-153. by Y. Iwane, Y. Morizono, Y. Ohno, N. Kuwano posted to lead-free whiskers by vidal31 on 2007-07-13 10:09:58 as
	PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement [My Copy] Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International (2004), pp. 40-44. by J. D. Kim, W. S. Choi, K. S. Park, E. H. Kim, S. B. Lee, H. G. Kim posted to lead-free whiskers by vidal31 on 2007-07-13 10:08:08 as
	Whisker test methods of JEITA whisker growth mechanism for test methods [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 10-16. by I. Sakamoto posted to lead-free whiskers by vidal31 on 2007-07-13 10:06:27 as
	Characterization study of lead-free Sn-Cu plated packages [My Copy] Electronic Components and Technology Conference, 2002. Proceedings. 52nd (2002), pp. 1238-1245. by J. C. B. Lee, Yung-Ling Yao, Fang-Yi Chiang, P. J. Zheng, C. C. Liao, Y. S. Chou posted to lead-free whiskers by vidal31 on 2007-07-13 10:04:52 as
	Lessons learnt from lead-free soldering implementation - real example [My Copy] Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 42-50. by W. M. Cheng, H. Y. Wu posted to lead-free whiskers by vidal31 on 2007-07-13 10:02:48 as
	Role of intrinsic stresses in the phenomena of tin whiskers in electrical connectors [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 63-74. by S. Lal, T. D. Moyer posted to lead-free whiskers by vidal31 on 2007-07-13 10:01:10 as
	Transition to lead free soldering - a great change for a better understanding of materials and processes and green electronics [My Copy] Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 33-36. by J. Mueller, H. Griese, K. Schischke, L. Stobbe posted to lead-free whiskers by vidal31 on 2007-07-13 09:59:47 as
	Nano nickel-tin interconnects and electrodes for next generation 15 micron pitch embedded bio fluidic sensors in FR4 substrates [My Copy] Electronic Components and Technology Conference, 2006. Proceedings. 56th (2006), 3 pp.. by R. Doraiswami posted to lead-free whiskers by vidal31 on 2007-07-13 09:57:40 as
	Lead-free plating for semiconductor devices qualification & implementation [My Copy] Electronics Packaging Technology, 2003 5th Conference (EPTC 2003) (2003), pp. 59-64. by A. Sriyarunya, R. Schetty posted to lead-free whiskers by vidal31 on 2007-07-13 09:50:16 as
	Manufacturability and reliability of lead-free package [My Copy] Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the (2004), pp. 105-109. by A. Sriyarunya posted to lead-free whiskers by vidal31 on 2007-07-13 09:45:39 as
	Analysis of Lead Free Tin Whisker Test Methodology and Characterization [My Copy] ROCS Workshop, 2006. [Reliability of Compound Semiconductors] (2006), pp. 41-54. by Helen Cui, Mike Ferrara, Matthew Mlcak posted to lead-free whiskers by vidal31 on 2007-07-13 09:41:47 as
	Lead-free semiconductor packaging [My Copy] Electronics Packaging Technology Conference, 2002. 4th (2002), pp. 11-19. by C. C. M. Beelen-Hendrikx, J. Klerk, J. T. van der Water posted to lead-free whiskers by vidal31 on 2007-07-13 09:37:39 as
	Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - MIL-P-15736/4 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:38:38 as
	GLASS, POTASH SODA BARIUM, LEAD-FREE COMPRESSION SEALING (NO S/S DOCUMENT) - MIL-G-47032A NOT 1 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:38:01 as
	Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components (FOREIGN STANDARD) - JIS Z 3198-7:2003 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:37:17 as
	Test methods for lead-free solders -- Part 6: Methods for 45opull test of solder joints on QFP lead (FOREIGN STANDARD) - JIS Z 3198-6:2003 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:36:40 as
	Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints (FOREIGN STANDARD) - JIS Z 3198-5:2003 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:36:06 as
	Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method (FOREIGN STANDARD) - JIS Z 3198-4:2003 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:35:26 as
	Test methods for lead-free solders -- Part 3: Methods for spread test (FOREIGN STANDARD) - JIS Z 3198-3:2003 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:34:43 as
	Test methods for lead-free solders -- Part 2: Methods for testing of mechanical characteristics-tensile test (FOREIGN STANDARD) - JIS Z 3198-2:2003 [My Copy] posted to lead-free by vidal31 on 2007-07-13 08:34:04 as

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vidal31's library 136 articles Export

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