Challenges in converting to lead-free electronics

by: CM Garner, V Gupta, V Bissessur, A Kumar, R Aspandiar

Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd (2000), pp. 6-9.

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Abstract

For effective migration to lead-free electronics, the industry must identify a number of lead-free compatible solders, establish an effective assembly process temperature hierarchy, and have a large number of components that are compatible with this thermal hierarchy. In this paper, we propose a temperature hierarchy for lead-free reflow soldering, discuss the critical factors in developing an optimal lead-free reflow profile, and identify the challenges in making packages compatible with the higher solder temperatures associated with lead-free solders. We also briefly review the lead-free materials direction and challenges for solder ball interconnects, component termination and board finishes

@inproceedings{citeulike:1453680, abstract = {For effective migration to lead-free electronics, the industry must identify a number of lead-free compatible solders, establish an effective assembly process temperature hierarchy, and have a large number of components that are compatible with this thermal hierarchy. In this paper, we propose a temperature hierarchy for lead-free reflow soldering, discuss the critical factors in developing an optimal lead-free reflow profile, and identify the challenges in making packages compatible with the higher solder temperatures associated with lead-free solders. We also briefly review the lead-free materials direction and challenges for solder ball interconnects, component termination and board finishes}, author = {Garner, C. M. and Gupta, V. and Bissessur, V. and Kumar, A. and Aspandiar, R. }, citeulike-article-id = {1453680}, doi = {http://dx.doi.org/10.1109/EPTC.2000.906340\%20}, journal = {Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd}, keywords = {lead-free}, pages = {6--9}, posted-at = {2007-07-13 10:43:36}, priority = {2}, title = {Challenges in converting to lead-free electronics}, url = {http://dx.doi.org/10.1109/EPTC.2000.906340\%20}, year = {2000} }

RIS record

TY - CONF ID - citeulike:1453680 L3 - citeulike-article-id:1453680 TI - Challenges in converting to lead-free electronics JF - Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd SP - 6 EP - 9 N2 - For effective migration to lead-free electronics, the industry must identify a number of lead-free compatible solders, establish an effective assembly process temperature hierarchy, and have a large number of components that are compatible with this thermal hierarchy. In this paper, we propose a temperature hierarchy for lead-free reflow soldering, discuss the critical factors in developing an optimal lead-free reflow profile, and identify the challenges in making packages compatible with the higher solder temperatures associated with lead-free solders. We also briefly review the lead-free materials direction and challenges for solder ball interconnects, component termination and board finishes KW - lead-free AU - Garner, CM AU - Gupta, V AU - Bissessur, V AU - Kumar, A AU - Aspandiar, R PY - 2000/// UR - http://dx.doi.org/10.1109/EPTC.2000.906340%20 ER -

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