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vidal31's Schetty:R [2 articles] Export Sort

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	Electrodeposited tin properties & their effect on component finish reliability [My Copy] Business of Electronic Product Reliability and Liability, 2004 International Conference on (2004), pp. 29-34. by R. Schetty posted to lead-free whiskers by vidal31 on 2007-07-13 10:27:09 as
	Lead-free plating for semiconductor devices qualification & implementation [My Copy] Electronics Packaging Technology, 2003 5th Conference (EPTC 2003) (2003), pp. 59-64. by A. Sriyarunya, R. Schetty posted to lead-free whiskers by vidal31 on 2007-07-13 09:50:16 as

vidal31's Schetty:R [2 articles] Export Sort

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