vidal31's whiskers [23 articles] Export

Recent papers added to vidal31's library classified by the tag whiskers. You can also see everyone's whiskers.

	Structure and kinetics of Sn whisker growth on Pb-free solder finish [My Copy] Electronic Components and Technology Conference, 2002. Proceedings. 52nd (2002), pp. 628-633. by W. J. Choi, T. Y. Lee, K. N. Tu, et al.N. Tamura, R. S. Celestre, A. A. Macdowell, Y. Y. Bong, L. Nguyen, G. T. T. Sheng posted to lead-free whiskers by vidal31 on 2007-07-13 10:28:59 as
	Electrodeposited tin properties & their effect on component finish reliability [My Copy] Business of Electronic Product Reliability and Liability, 2004 International Conference on (2004), pp. 29-34. by R. Schetty posted to lead-free whiskers by vidal31 on 2007-07-13 10:27:09 as
	Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 36-62. by J. W. Osenbach, R. L. Shook, B. T. Vaccaro, et al.B. D. Potteiger, A. N. Amin, K. N. Hooghan, P. Suratkar, P. Ruengsinsub posted to lead-free whiskers by vidal31 on 2007-07-13 10:25:41 as
	Detection of tin plating and tin whisker mitigation [My Copy] Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International (2004), pp. 563-564. by W. D. Bjorndahl, L. Singleton, R. Griese, F. Chong posted to lead-free whiskers by vidal31 on 2007-07-13 10:24:06 as
	Pb-free plating: a process and solder joint reliability study [My Copy] Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th (2004), pp. 162-168. by Ming S. Ong, Yi M. Lau, Ah C. Tan posted to lead-free whiskers by vidal31 on 2007-07-13 10:22:01 as
	Matte tin (Sn) plating: whisker growth study [My Copy] Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th (2004), pp. 281-288. by A. Sriyarunya, J. Tondtan, D. Bansal posted to lead-free whiskers by vidal31 on 2007-07-13 10:20:37 as
	Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy [My Copy] Electronics Packaging Technology Conference, 2006. EPTC '06. 8th (2006), pp. 398-403. by H. Sosiati, N. Kuwano, S. Hata, Y. Iwane, Y. Morizono, Y. Ohno posted to lead-free whiskers by vidal31 on 2007-07-13 10:17:51 as
	Portable X-ray fluorescence analyzer for the first level screening of materials for prohibited substances [My Copy] Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 7-13. by S. Piorek posted to lead-free whiskers by vidal31 on 2007-07-13 10:16:27 as
	Lead free packaging and Sn-whiskers [My Copy] Electronic Components and Technology Conference, 2004. Proceedings. 54th, Vol. 2 (2004), pp. 1314-1324 Vol.2. by J. W. Osenbach, R. L. Shook, B. T. Vaccaro, B. D. Potteiger, A. Amin, P. Ruengsinsub posted to lead-free whiskers by vidal31 on 2007-07-13 10:14:52 as
	Carbon Nanotube Filled Conductive Adhesives for Aerospace Applications [My Copy] Aerospace Conference, 2007 IEEE (2007), pp. 1-6. by Jing Li, Janet K. Lumpp posted to lead-free whiskers by vidal31 on 2007-07-13 10:13:16 as
	The Sn Whisker Growth Evolution of IC Packaging on the PC Board Assembly [My Copy] Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th (2007), pp. 1964-1970. by Jeffrey C. Lee, P. C. Chen, C. G. Tyan posted to lead-free whiskers by vidal31 on 2007-07-13 10:11:28 as
	Behavior of whisker growth on tin plated Fe-42%Ni substrates [My Copy] Electronics Packaging Technology Conference, 2006. EPTC '06. 8th (2006), pp. 150-153. by Y. Iwane, Y. Morizono, Y. Ohno, N. Kuwano posted to lead-free whiskers by vidal31 on 2007-07-13 10:09:58 as
	PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement [My Copy] Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International (2004), pp. 40-44. by J. D. Kim, W. S. Choi, K. S. Park, E. H. Kim, S. B. Lee, H. G. Kim posted to lead-free whiskers by vidal31 on 2007-07-13 10:08:08 as
	Whisker test methods of JEITA whisker growth mechanism for test methods [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 10-16. by I. Sakamoto posted to lead-free whiskers by vidal31 on 2007-07-13 10:06:27 as
	Characterization study of lead-free Sn-Cu plated packages [My Copy] Electronic Components and Technology Conference, 2002. Proceedings. 52nd (2002), pp. 1238-1245. by J. C. B. Lee, Yung-Ling Yao, Fang-Yi Chiang, P. J. Zheng, C. C. Liao, Y. S. Chou posted to lead-free whiskers by vidal31 on 2007-07-13 10:04:52 as
	Lessons learnt from lead-free soldering implementation - real example [My Copy] Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 42-50. by W. M. Cheng, H. Y. Wu posted to lead-free whiskers by vidal31 on 2007-07-13 10:02:48 as
	Role of intrinsic stresses in the phenomena of tin whiskers in electrical connectors [My Copy] Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 63-74. by S. Lal, T. D. Moyer posted to lead-free whiskers by vidal31 on 2007-07-13 10:01:10 as
	Transition to lead free soldering - a great change for a better understanding of materials and processes and green electronics [My Copy] Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 33-36. by J. Mueller, H. Griese, K. Schischke, L. Stobbe posted to lead-free whiskers by vidal31 on 2007-07-13 09:59:47 as
	Nano nickel-tin interconnects and electrodes for next generation 15 micron pitch embedded bio fluidic sensors in FR4 substrates [My Copy] Electronic Components and Technology Conference, 2006. Proceedings. 56th (2006), 3 pp.. by R. Doraiswami posted to lead-free whiskers by vidal31 on 2007-07-13 09:57:40 as
	Lead-free plating for semiconductor devices qualification & implementation [My Copy] Electronics Packaging Technology, 2003 5th Conference (EPTC 2003) (2003), pp. 59-64. by A. Sriyarunya, R. Schetty posted to lead-free whiskers by vidal31 on 2007-07-13 09:50:16 as
	Manufacturability and reliability of lead-free package [My Copy] Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the (2004), pp. 105-109. by A. Sriyarunya posted to lead-free whiskers by vidal31 on 2007-07-13 09:45:39 as
	Analysis of Lead Free Tin Whisker Test Methodology and Characterization [My Copy] ROCS Workshop, 2006. [Reliability of Compound Semiconductors] (2006), pp. 41-54. by Helen Cui, Mike Ferrara, Matthew Mlcak posted to lead-free whiskers by vidal31 on 2007-07-13 09:41:47 as
	Lead-free semiconductor packaging [My Copy] Electronics Packaging Technology Conference, 2002. 4th (2002), pp. 11-19. by C. C. M. Beelen-Hendrikx, J. Klerk, J. T. van der Water posted to lead-free whiskers by vidal31 on 2007-07-13 09:37:39 as

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lead-free	78
visualisation	29
whiskers	23
string-matching	20
algorithmes	9
vectorial	5
edit-distance	2
tree	2
bioterrorism	1
butterfly	1
currency	1
de	1
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evaluation	1
expression	1
lecture	1
levenshtein	1
matching	1
mmorpg	1
money	1
network	1
neurones	1
pattern	1
rcursivit	1
rgulire	1
rseaux	1
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trees	1
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vidal31's whiskers [23 articles] Export

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