Metal-organic thin-film encapsulation for MEMS Export

@article{citeulike:3368027, abstract = {This paper demonstrates a metal-organic thin-film encapsulation technique based on the photolithography of multiple layers of positive-tone photo-definable polymer. This encapsulation process, performed at low temperatures (\<110 \&\#176;C) in a standard basic developer, leaves no residue. Piezoelectrically-actuated length-extensional bulk acoustic wave resonators were successfully encapsulated for a proof-of-concept demonstration. Blanket metallization can lead to complete sealing, which helps exclude moisture and particles from sensitive MEMS devices such as high frequency resonators, RF filters and inertial transducers.}, author = {Fang, J. and Fu, J. and Ayazi, F.}, citeulike-article-id = {3368027}, citeulike-linkout-0 = {http://dx.doi.org/10.1088/0960-1317/18/10/105002}, doi = {10.1088/0960-1317/18/10/105002}, journal = {Journal of Micromechanics and Microengineering}, keywords = {packaging}, number = {10}, pages = {105002+}, posted-at = {2009-06-24 06:08:48}, priority = {2}, title = {Metal-organic thin-film encapsulation for MEMS}, url = {http://dx.doi.org/10.1088/0960-1317/18/10/105002}, volume = {18}, year = {2008} }

TY - JOUR ID - citeulike:3368027 L3 - citeulike-article-id:3368027 N2 - This paper demonstrates a metal-organic thin-film encapsulation technique based on the photolithography of multiple layers of positive-tone photo-definable polymer. This encapsulation process, performed at low temperatures (<110 °C) in a standard basic developer, leaves no residue. Piezoelectrically-actuated length-extensional bulk acoustic wave resonators were successfully encapsulated for a proof-of-concept demonstration. Blanket metallization can lead to complete sealing, which helps exclude moisture and particles from sensitive MEMS devices such as high frequency resonators, RF filters and inertial transducers. IS - 10 JF - Journal of Micromechanics and Microengineering TI - Metal-organic thin-film encapsulation for MEMS VL - 18 SP - 105002 KW - packaging AU - Fang, J AU - Fu, J AU - Ayazi, F PY - 2008/// UR - http://dx.doi.org/10.1088/0960-1317/18/10/105002 ER -