Deep dry etching techniques as a new IC compatible tool for siliconmicromachining Export

@inproceedings{Linder1991, address = {San Francisco, CA, USA}, author = {Linder, C. and Tschan, T. and Rooij, De N. F.}, booktitle = {Digest of Technical Papers, TRANSDUCERS '91, 1991 International Conference on Solid-State Sensors and Actuators}, citeulike-article-id = {3138404}, citeulike-linkout-0 = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=148928}, keywords = {drie, surface-roughness}, pages = {524--527}, pdf = {papers\\DRIE\\Deep.dry.etching.techniques.as.new.IC.compatible.tool.siliconmicromachining.pdf}, posted-at = {2008-08-20 03:12:55}, priority = {2}, title = {Deep dry etching techniques as a new IC compatible tool for siliconmicromachining}, url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=148928}, year = {1991} }

TY - CONF ID - Linder1991 L3 - citeulike-article-id:3138404 AD - San Francisco, CA, USA EP - 527 TI - Deep dry etching techniques as a new IC compatible tool for siliconmicromachining T2 - Digest of Technical Papers, TRANSDUCERS '91, 1991 International Conference on Solid-State Sensors and Actuators SP - 524 KW - drie KW - surface-roughness AU - Linder, C AU - Tschan, T AU - Rooij, De PY - 1991/// UR - http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=148928 ER -