RF W-band wafer-to-wafer transition Export

@article{citeulike:3378542, abstract = {Multiwafer silicon designs must provide an avenue for electrical signals to flow from wafer to wafer. For this purpose, a two-layer electrical bond is proposed to provide electrical connection between two coplanar waveguides printed on the adjacent faces of two vertically stacked silicon wafers. In addition to serving as a versatile low-temperature thermocompression wafer bond, loss of approximately 0.1 dB is measured for this novel compact packaged wafer-to-wafer transition from 75 to 110 GHz}, author = {Herrick, K. J. and Katehi, L. P. B.}, booktitle = {Microwave Theory and Techniques, IEEE Transactions on}, citeulike-article-id = {3378542}, citeulike-linkout-0 = {http://dx.doi.org/10.1109/22.915432}, citeulike-linkout-1 = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=915432}, doi = {10.1109/22.915432}, journal = {Microwave Theory and Techniques, IEEE Transactions on}, keywords = {bonding, rf-transition, thermal-compression}, number = {4}, pages = {600--608}, posted-at = {2008-10-06 07:15:55}, priority = {3}, title = {RF W-band wafer-to-wafer transition}, url = {http://dx.doi.org/10.1109/22.915432}, volume = {49}, year = {2001} }

TY - JOUR ID - citeulike:3378542 L3 - citeulike-article-id:3378542 N2 - Multiwafer silicon designs must provide an avenue for electrical signals to flow from wafer to wafer. For this purpose, a two-layer electrical bond is proposed to provide electrical connection between two coplanar waveguides printed on the adjacent faces of two vertically stacked silicon wafers. In addition to serving as a versatile low-temperature thermocompression wafer bond, loss of approximately 0.1 dB is measured for this novel compact packaged wafer-to-wafer transition from 75 to 110 GHz IS - 4 JF - Microwave Theory and Techniques, IEEE Transactions on EP - 608 TI - RF W-band wafer-to-wafer transition VL - 49 T2 - Microwave Theory and Techniques, IEEE Transactions on SP - 600 KW - bonding KW - rf-transition KW - thermal-compression AU - Herrick, KJ AU - Katehi, LPB PY - 2001/// UR - http://dx.doi.org/10.1109/22.915432 ER -