Power and Interface Features of Thermosonic Flip-Chip Bonding

@article{citeulike:3502308, abstract = {Driving voltage and current signals of piezoceramic transducer were measured directly by using digital storage oscilloscope, and interface microcharacteristics of the specimens of flip-chip bonding were inspected by using a transmission electron microscope. Results show such a trend that power curves of badly bonding were much lower than that of hard bonding, and indicated a monitoring system of ultrasonic bonding reliability. The acceleration of ultrasonic vibration was about several ten thousand times as acceleration of gravity, which activates dislocations inside the metal crystalline lattice which act as the fast diffusion channels. Dislocation diffusion is more prominent than the crystal diffusion when the temperature is low. Differing from thermal melting mechanism of the reflow bonding, the ultrasonic bonding is much faster than the reflow solder bonding.}, author = {Li, Junhui and Han, Lei and Zhong, Jue}, booktitle = {Advanced Packaging, IEEE Transactions on}, citeulike-article-id = {3502308}, doi = {10.1109/TADVP.2008.927828}, journal = {Advanced Packaging, IEEE Transactions on}, keywords = {packaging, thermosonic}, number = {3}, pages = {442--446}, posted-at = {2008-11-11 03:50:11}, priority = {2}, title = {Power and Interface Features of Thermosonic Flip-Chip Bonding}, url = {http://dx.doi.org/10.1109/TADVP.2008.927828}, volume = {31}, year = {2008} }

TY - JOUR ID - citeulike:3502308 L3 - citeulike-article-id:3502308 N2 - Driving voltage and current signals of piezoceramic transducer were measured directly by using digital storage oscilloscope, and interface microcharacteristics of the specimens of flip-chip bonding were inspected by using a transmission electron microscope. Results show such a trend that power curves of badly bonding were much lower than that of hard bonding, and indicated a monitoring system of ultrasonic bonding reliability. The acceleration of ultrasonic vibration was about several ten thousand times as acceleration of gravity, which activates dislocations inside the metal crystalline lattice which act as the fast diffusion channels. Dislocation diffusion is more prominent than the crystal diffusion when the temperature is low. Differing from thermal melting mechanism of the reflow bonding, the ultrasonic bonding is much faster than the reflow solder bonding. IS - 3 JF - Advanced Packaging, IEEE Transactions on EP - 446 TI - Power and Interface Features of Thermosonic Flip-Chip Bonding VL - 31 T2 - Advanced Packaging, IEEE Transactions on SP - 442 KW - packaging KW - thermosonic AU - Li, Junhui AU - Han, Lei AU - Zhong, Jue PY - 2008/// UR - http://dx.doi.org/10.1109/TADVP.2008.927828 ER -