An Analytical Fringe Capacitance Model for Interconnects Using Conformal Mapping Export

@article{Roy:2006, abstract = {An analytical model is proposed to compute the fringe capacitance between two nonoverlapping interconnects in different layers using a conformal mapping technique. With this technique, electric field lines are geometrically approximated to separately model the different capacitive components. These components are finally combined to obtain the equivalent fringe capacitance. Using the aforementioned technique, a model was developed to compute the capacitances of typical interconnect geometries using technology-dependent parameters. The proposed model closely matches with FASTCAP results and significantly reduces the computational complexity and time in calculating the interconnect capacitances}, author = {Bansal, Aditya and Paul, Bipul C. and Roy, Kaushik}, booktitle = {Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on}, citeulike-article-id = {4037211}, citeulike-linkout-0 = {http://dx.doi.org/10.1109/TCAD.2006.882489}, citeulike-linkout-1 = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4014516}, doi = {10.1109/TCAD.2006.882489}, journal = {Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on}, keywords = {conformal-mapping, fringing-field}, number = {12}, pages = {2765--2774}, posted-at = {2009-02-11 23:30:19}, priority = {2}, title = {An Analytical Fringe Capacitance Model for Interconnects Using Conformal Mapping}, url = {http://dx.doi.org/10.1109/TCAD.2006.882489}, volume = {25}, year = {2006} }

TY - JOUR ID - Roy:2006 L3 - citeulike-article-id:4037211 N2 - An analytical model is proposed to compute the fringe capacitance between two nonoverlapping interconnects in different layers using a conformal mapping technique. With this technique, electric field lines are geometrically approximated to separately model the different capacitive components. These components are finally combined to obtain the equivalent fringe capacitance. Using the aforementioned technique, a model was developed to compute the capacitances of typical interconnect geometries using technology-dependent parameters. The proposed model closely matches with FASTCAP results and significantly reduces the computational complexity and time in calculating the interconnect capacitances IS - 12 JF - Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on EP - 2774 TI - An Analytical Fringe Capacitance Model for Interconnects Using Conformal Mapping VL - 25 T2 - Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on SP - 2765 KW - conformal-mapping KW - fringing-field AU - Bansal, Aditya AU - Paul, Bipul AU - Roy, Kaushik PY - 2006/// UR - http://dx.doi.org/10.1109/TCAD.2006.882489 ER -