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	Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment [My Copy] Journal of Micromechanics and Microengineering, Vol. 19, No. 3. (2009), 033001. by H. V. Jansen, De M. J. Boer, S. Unnikrishnan, M. C. Louwerse, M. C. Elwenspoek posted to drie rie by z3phyr on 2009-02-26 19:52:08 as
	The black silicon method : a universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control [My Copy] Journal of Micromechanics and Microengineering, Vol. 5 (1995), pp. 115-120. by H. V. Jansen, M. de Boer, R. Legtenberg, M. Elwenspoek posted to drie micrograss by z3phyr on 2008-08-20 03:12:53 as
	A Survey on The Reactive Ion Etching of Silicon in Microtechnology [My Copy] Journal of Micromechanics and Microengineering, Vol. 6 (1996), pp. 14-28. by H. V. Jansen, M. de Boer, M. Elwenspoek, H. Gardeniers, J. Fluitman posted to micrograss review rie by z3phyr on 2008-08-20 03:12:53 as
	The Black Silicon Method VI: High Aspect Ratio Trench Etching for MEMS Applications [My Copy] In Proceedings of IEEE International Workshop of Micro-Electro-Mechanical Systems (1995) by H. V. Jansen, M. de Boer, M. Elwenspoek posted to micrograss rie by z3phyr on 2008-08-20 03:12:53 as

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