z3phyr's Li:J [3 articles] Export

Recent papers posted to z3phyr's library by the author Li:J. You can also see everyone's Li:J.

	Power and Interface Features of Thermosonic Flip-Chip Bonding [My Copy] Advanced Packaging, IEEE Transactions on In Advanced Packaging, IEEE Transactions on, Vol. 31, No. 3. (2008), pp. 442-446. by Junhui Li, Lei Han, Jue Zhong posted to packaging thermosonic by z3phyr on 2008-11-11 03:50:11 as along with 1 person wongmld
	A piezoresistive cantilever for lateral force detection fabricated by a monolithic post-CMOS process [My Copy] Journal of Micromechanics and Microengineering, Vol. 18, No. 11. (2008), 115001. by Xu Ji, Zhihong Li, Jianzhong Xi, Juan Li, Yangyuan Wang posted to cmos-mems piezoelectric-actuation by z3phyr on 2008-10-23 01:27:39 as
	Deep-reactive ion-etched compliant starting zone electrostatic zipping actuators [My Copy] Journal of Microelectromechanical Systems, Vol. 14, No. 6. (2005) by Jian Li, M. P. Brenner, T. Christen, M. S. Kotilainen, J. H. Lang, A. H. Slocum posted to actuation electrostatic mems pullin-voltage by z3phyr on 2008-08-20 03:12:55 as

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mems	46
rf-mems	30
rfic	17
varactor	16
695	13
doherty	13
power-amplifier	13
review	13
micromachining	12
actuation	11
drie	11
electrostatic	10
mems-switch	9
cmos	8
dynamics	8
packaging	8
rie	7
cpw	6
filter	6
microstrip-filters	6
modelling	6
nems	6
pullin-voltage	6
tunable-filters	6
antenna	5
fringing-field	5
micrograss	5
piezoelectric-actuation	5
surface-roughness	5
van-der-waals	5
wet-etching	5
filter-synthesis	4
polymer	4
reconfigurable-antenna	4
casimir-effect	3
cmos-mems	3
conformal-mapping	3
dielectric	3
dual-band	3
measurement	3
mems-market	3
parylene	3
transmission-line	3
bonding	2
capacitance-measurement	2
capacitive-switch	2
cavity-fitlers	2
cnt	2
cryogenic	2
electrostatic-actuation	2
evanescent-mode-resonator	2
filters	2
hermetic	2
lagrangian	2
lcp	2
liquid-metal	2
metal-contact	2
microfabrication	2
microfluidics	2
phased-arrays	2
phaseshifter	2
power-divider	2
recipe	2
reliability	2
switched-capacitor	2
system-design	2
3d-interconnect	1
absorptive-switch	1
antistick-passivation	1
cellular-automata	1
cognitive-radio	1
constant-bandwidth	1
coupling-matrix	1
cpw-microstrip	1
creep	1
dc-switch	1
dgs	1
dielectric-charging	1
dual-mode-waveguide-filter	1
easa	1
ebg	1
efab	1
electromagnetics	1
electrothermal	1
electrowetting	1
fss	1
harpss	1
information-theory	1
infrared-sensor	1
klystron	1
koh	1
lab-on-chip	1
lateral-contact	1
lincoln-lab-switch	1
linearity	1
linearization	1
liquid-crystal	1
ltcc	1
materials	1
mement-method	1
mems-test	1
memtronic-switch	1
metamaterials	1
micro-assembly	1
micromechanical-resonator	1
micropumps	1
neural-network	1
nonlinear	1
omems	1
piezoresistive	1
plasma	1
pyrex	1
residual-stress	1
resonators	1
rf-transition	1
roughness	1
schwartz-christoffer	1
si-ge	1
snap-through	1
software-defined-radio	1
soi-mems	1
spiral-antenna	1
spurious-mode	1
stepped-impedance-resonators	1
strain-sensor	1
surface	1
surface-micromachining	1
surface-modification	1
teflon	1
temperature-stability	1
terahertz	1
testing	1
thermal-compression	1
thermal-contact	1
thermosonic	1
transition	1
tunable-inductors	1
tunable-resonator	1
uwb	1
vacuum-science	1
varactor-tunable	1
waveguide	1
wireless-communication	1

z3phyr's Li:J [3 articles] Export

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